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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Manufacturer Part Number | Size / Dimension | Module/Board Type | Operating System | Core Processor | Connector Type | Reverse Recovery Time (trr) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| XCKU035-L1FBVA900I | Xilinx | IC FPGA 468 I/O 900FCBGA | Kintex® UltraScale™ | -40°C ~ 100°C (TJ) | - | - | - | - | - | - | - | |
| EP20K300EFC672-1N | Altera (Intel® Programmable Solutions Group) | IC FPGA 408 I/O 672FBGA | APEX-20KE® | 0°C ~ 85°C (TJ) | - | - | - | - | - | - | - | |
| XC7K325T-3FBG900E | Xilinx | IC FPGA 500 I/O 900FCBGA | Kintex®-7 | 0°C ~ 100°C (TJ) | - | - | - | - | - | - | - | |
| A54SX16P-2TQ144 | Microsemi | IC FPGA 113 I/O 144TQFP | SX | 0°C ~ 70°C (TA) | - | - | - | - | - | - | - | |
| XC3S1000-5FGG456C | Xilinx | IC FPGA 333 I/O 456FBGA | Spartan®-3 | 0°C ~ 85°C (TJ) | - | - | - | - | - | - | - | |
| EP2S60F672C3N | Intel® FPGAs | IC FPGA 492 I/O 672FBGA | Stratix® II | 0°C ~ 85°C (TJ) | - | - | - | - | - | - | - | |
| XCV50E-6CS144I | Xilinx | IC FPGA 94 I/O 144CSBGA | Virtex®-E | -40°C ~ 100°C (TJ) | - | - | - | - | - | - | - | |
| EP4SGX230DF29I3N | Altera (Intel® Programmable Solutions Group) | IC FPGA 372 I/O 780FBGA | Stratix® IV GX | -40°C ~ 100°C (TJ) | - | - | - | - | - | - | - | |
| 10M08SAE144I7P | Altera (Intel® Programmable Solutions Group) | IC FPGA 101 I/O 144EQFP | MAX® 10 | -40°C ~ 100°C (TJ) | - | - | - | - | - | - | - | |
| LCMXO2-1200ZE-3SG32C | Lattice Semiconductor | IC FPGA 21 I/O 32QFN | MachXO2 | 0°C ~ 85°C (TJ) | - | - | - | - | - | - | - |
FPGAs are semiconductor devices that contain configurable logic blocks and interconnects, allowing users to implement custom digital logic circuits. Unlike microcontrollers and microprocessors, which execute predefined instructions, FPGAs can be programmed to perform specific tasks by configuring the interconnections between logic blocks. This flexibility makes FPGAs suitable for a wide range of applications, including digital signal processing, telecommunications, data processing, and hardware acceleration.