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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Manufacturer Part Number | Size / Dimension | Module/Board Type | Operating System | Core Processor | Connector Type | Reverse Recovery Time (trr) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| XC6VLX130T-2FFG784C | Xilinx | IC FPGA 400 I/O 784FCBGA | Virtex®-6 LXT | 0°C ~ 85°C (TJ) | - | - | - | - | - | - | - | |
| XC3S700A-5FGG400C | Xilinx | IC FPGA 311 I/O 400FBGA | Spartan®-3A | 0°C ~ 85°C (TJ) | - | - | - | - | - | - | - | |
| EP4SE820H35C4 | Altera (Intel® Programmable Solutions Group) | IC FPGA 744 I/O 1152HBGA | STRATIX® IV E | 0°C ~ 85°C (TJ) | - | - | - | - | - | - | - | |
| EP3SL150F780C3N | Altera (Intel® Programmable Solutions Group) | IC FPGA 488 I/O 780FBGA | Stratix® III L | 0°C ~ 85°C (TJ) | - | - | - | - | - | - | - | |
| XCVU125-H1FLVD1517E | Xilinx | IC FPGA | Virtex® UltraScale™ | 0°C ~ 100°C (TJ) | - | - | - | - | - | - | - | |
| XC7K480T-2FFG901I | Xilinx | IC FPGA 380 I/O 901FCBGA | Kintex®-7 | -40°C ~ 100°C (TJ) | - | - | - | - | - | - | - | |
| EP2AGX190FF35C6N | Intel® FPGAs | IC FPGA 612 I/O 11152FBGA | Arria II GX | 0°C ~ 85°C (TJ) | - | - | - | - | - | - | - | |
| AGLN030V2-ZVQ100I | Microsemi | IC FPGA 77 I/O 100VQFP | IGLOO nano | -40°C ~ 100°C (TJ) | - | - | - | - | - | - | - | |
| 10CX105YU484I6G | Intel® FPGAs | 484-PIN UBGA | Cyclone® 10 GX | -40°C ~ 100°C (TJ) | - | - | - | - | - | - | - | |
| EP4SGX110FF35C4N | Altera (Intel® Programmable Solutions Group) | IC FPGA 372 I/O 1152FBGA | Stratix® IV GX | 0°C ~ 85°C (TJ) | - | - | - | - | - | - | - |
FPGAs are semiconductor devices that contain configurable logic blocks and interconnects, allowing users to implement custom digital logic circuits. Unlike microcontrollers and microprocessors, which execute predefined instructions, FPGAs can be programmed to perform specific tasks by configuring the interconnections between logic blocks. This flexibility makes FPGAs suitable for a wide range of applications, including digital signal processing, telecommunications, data processing, and hardware acceleration.