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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Manufacturer Part Number | Size / Dimension | Module/Board Type | Operating System | Core Processor | Connector Type | Reverse Recovery Time (trr) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| EP2AGX125EF35I5 | Intel® FPGAs | IC FPGA 452 I/O 1152FBGA | Arria II GX | -40°C ~ 100°C (TJ) | - | - | - | - | - | - | - | |
| LFXP2-40E-6F484C | Lattice Semiconductor | IC FPGA 363 I/O 484FBGA | XP2 | 0°C ~ 85°C (TJ) | - | - | - | - | - | - | - | |
| LFXP3C-5TN100C | Lattice Semiconductor | IC FPGA 62 I/O 100TQFP | XP | 0°C ~ 85°C (TJ) | - | - | - | - | - | - | - | |
| A3P060-CS121 | Microsemi | IC FPGA 96 I/O 121CSP | ProASIC3 | 0°C ~ 85°C (TJ) | - | - | - | - | - | - | - | |
| A3P030-VQ100 | Microsemi | IC FPGA 77 I/O 100VQFP | ProASIC3 | 0°C ~ 85°C (TJ) | - | - | - | - | - | - | - | |
| EP1C6F256C8N | Intel® FPGAs | IC FPGA 185 I/O 256FBGA | Cyclone® | 0°C ~ 85°C (TJ) | - | - | - | - | - | - | - | |
| LFEC1E-4TN144C | Lattice Semiconductor | IC FPGA 97 I/O 144TQFP | EC | 0°C ~ 85°C (TJ) | - | - | - | - | - | - | - | |
| 5SGXEA5N1F40I2N | Altera (Intel® Programmable Solutions Group) | IC FPGA 600 I/O 1517FBGA | Stratix® V GX | -40°C ~ 100°C (TJ) | - | - | - | - | - | - | - | |
| EP2AGX65DF25C6NES | Altera (Intel® Programmable Solutions Group) | IC FPGA 252 I/O 572FBGA | Arria II GX | 0°C ~ 85°C (TJ) | - | - | - | - | - | - | - | |
| EP20K400CF672C8N | Altera (Intel® Programmable Solutions Group) | IC FPGA 488 I/O 672FBGA | APEX-20KC® | 0°C ~ 85°C (TJ) | - | - | - | - | - | - | - |
FPGAs are semiconductor devices that contain configurable logic blocks and interconnects, allowing users to implement custom digital logic circuits. Unlike microcontrollers and microprocessors, which execute predefined instructions, FPGAs can be programmed to perform specific tasks by configuring the interconnections between logic blocks. This flexibility makes FPGAs suitable for a wide range of applications, including digital signal processing, telecommunications, data processing, and hardware acceleration.