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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Manufacturer Part Number | Size / Dimension | Module/Board Type | Operating System | Core Processor | Connector Type | Reverse Recovery Time (trr) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| M2GL060-FG676 | Microsemi | IC FPGA 387 I/O 676FBGA | IGLOO2 | 0°C ~ 85°C (TJ) | - | - | - | - | - | - | - | |
| LFXP6E-3FN256I | Lattice Semiconductor | IC FPGA 188 I/O 256FBGA | XP | -40°C ~ 100°C (TJ) | - | - | - | - | - | - | - | |
| 5AGXMB3G4F40C5N | Intel® FPGAs | IC FPGA 704 I/O 1517FBGA | Arria V GX | 0°C ~ 85°C (TJ) | - | - | - | - | - | - | - | |
| EP20K200EFC484-2X | Intel® FPGAs | IC FPGA 376 I/O 484FBGA | APEX-20KE® | 0°C ~ 85°C (TJ) | - | - | - | - | - | - | - | |
| AGL1000V2-FG484 | Microsemi | IC FPGA 300 I/O 484FBGA | IGLOO | 0°C ~ 70°C (TA) | - | - | - | - | - | - | - | |
| XC4005XL-09VQ100C | Xilinx | IC FPGA 77 I/O 100VQFP | XC4000E/X | 0°C ~ 85°C (TJ) | - | - | - | - | - | - | - | |
| A3P1000-FGG484M | Microsemi | IC FPGA 300 I/O 484FBGA | ProASIC3 | -55°C ~ 125°C (TJ) | - | - | - | - | - | - | - | |
| EP1C6F256I7N | Intel® FPGAs | IC FPGA 185 I/O 256FBGA | Cyclone® | -40°C ~ 100°C (TJ) | - | - | - | - | - | - | - | |
| XC4VFX20-10FFG672I | Xilinx | IC FPGA 320 I/O 672FCBGA | Virtex®-4 FX | -40°C ~ 100°C (TJ) | - | - | - | - | - | - | - | |
| XC7VX690T-2FF1157C | 4D Systems | IC FPGA 600 I/O 1157FCBGA | Virtex®-7 XT | 0°C ~ 85°C (TJ) | XC7VX690T-2FF1157C | - | - | - | - | - | - |
FPGAs are semiconductor devices that contain configurable logic blocks and interconnects, allowing users to implement custom digital logic circuits. Unlike microcontrollers and microprocessors, which execute predefined instructions, FPGAs can be programmed to perform specific tasks by configuring the interconnections between logic blocks. This flexibility makes FPGAs suitable for a wide range of applications, including digital signal processing, telecommunications, data processing, and hardware acceleration.