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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Manufacturer Part Number | Size / Dimension | Module/Board Type | Operating System | Core Processor | Connector Type | Reverse Recovery Time (trr) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 5AGXBA7D4F27C5N | Altera (Intel® Programmable Solutions Group) | IC FPGA 336 I/O 672FBGA | Arria V GX | 0°C ~ 85°C (TJ) | - | - | - | - | - | - | - | |
| XC7VX330T-2FFG1761I | Xilinx | IC FPGA 700 I/O 1761FCBGA | Virtex®-7 XT | -40°C ~ 100°C (TJ) | - | - | - | - | - | - | - | |
| 5SGXMBBR3H43C2LN | Altera (Intel® Programmable Solutions Group) | IC FPGA 600 I/O 1760HBGA | Stratix® V GX | 0°C ~ 85°C (TJ) | - | - | - | - | - | - | - | |
| AT40K20AL-1AJC | Micrel / Microchip Technology | IC FPGA 20K GATES 84PLCC | AT40KAL | 0°C ~ 70°C | - | - | - | - | - | - | - | |
| XCKU115-L1FLVB1760I | Xilinx | IC FPGA | Kintex® UltraScale™ | -40°C ~ 100°C (TJ) | - | - | - | - | - | - | - | |
| A3PN060-2VQG100 | Microsemi | IC FPGA 71 I/O 100VQFP | ProASIC3 nano | -20°C ~ 85°C (TJ) | - | - | - | - | - | - | - | |
| LAE3-17EA-6FTN256E | Lattice Semiconductor | IC FPGA 133 I/O 256FTBGA | LA-ECP3 | -40°C ~ 125°C (TJ) | - | - | - | - | - | - | - | |
| XC5VLX50-2FFG1153I | Xilinx | IC FPGA 560 I/O 1153FCBGA | Virtex®-5 LX | -40°C ~ 100°C (TJ) | - | - | - | - | - | - | - | |
| ICE40HX1K-TQ144 | Lattice Semiconductor | IC FPGA 96 I/O 144TQFP | HX | -40°C ~ 100°C (TJ) | - | - | - | - | - | - | - | |
| XC5VLX110-1FF1153C | Xilinx | IC FPGA 800 I/O 1153FCBGA | Virtex®-5 LX | 0°C ~ 85°C (TJ) | - | - | - | - | - | - | - |
FPGAs are semiconductor devices that contain configurable logic blocks and interconnects, allowing users to implement custom digital logic circuits. Unlike microcontrollers and microprocessors, which execute predefined instructions, FPGAs can be programmed to perform specific tasks by configuring the interconnections between logic blocks. This flexibility makes FPGAs suitable for a wide range of applications, including digital signal processing, telecommunications, data processing, and hardware acceleration.