Loading products…
| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Manufacturer Part Number | Type | Lead Free Status | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| EPM7128SQC100-10YY | Altera (Intel® Programmable Solutions Group) | IC CPLD 128MC 10NS 100QFP | MAX® 7000S | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 100-BQFP | |
| XC95144XL-7CS144C | Xilinx | IC CPLD 144MC 7.5NS 144CSBGA | XC9500XL | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 144-TFBGA, CSPBGA | |
| ISPLSI 2064E-200LT100 | Lattice Semiconductor | IC CPLD 64MC 4.5NS 100TQFP | ispLSI® 2000E | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 100-LQFP | |
| LC4064V-25T48C | Lattice Semiconductor | IC CPLD 64MC 2.5NS 48TQFP | ispMACH® 4000V | 0°C ~ 90°C (TJ) | Tray | Surface Mount | - | - | - | - | 48-LQFP | |
| XC9536XL-7VQG44I | Xilinx | IC CPLD 36MC 7.5NS 44VQFP | XC9500XL | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 44-TQFP | |
| XCR3512XL-12FG324C | Xilinx | IC CPLD 512MC 10.8NS 324BGA | CoolRunner XPLA3 | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 324-BBGA | |
| CY37128P160-125AXI | Cypress Semiconductor | IC CPLD 128MC 10NS 160LQFP | Ultra37000™ | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 160-LQFP | |
| LC4384V-5FT256I | Lattice Semiconductor | IC CPLD 384MC 5NS 256FTBGA | ispMACH® 4000V | -40°C ~ 105°C (TJ) | Tray | Surface Mount | - | - | - | - | 256-LBGA | |
| LC4384V-75FTN256I | Lattice Semiconductor | IC CPLD 384MC 7.5NS 256FTBGA | ispMACH® 4000V | -40°C ~ 105°C (TJ) | Tray | Surface Mount | - | - | - | - | 256-LBGA | |
| LC4032ZC-75T48E | Lattice Semiconductor | IC CPLD 32MC 7.5NS 48TQFP | ispMACH® 4000Z | -40°C ~ 130°C (TJ) | Tray | Surface Mount | - | - | - | - | 48-LQFP |
CPLDs are programmable logic devices that contain configurable logic blocks and interconnects similar to FPGAs but with a smaller capacity and simpler architecture. CPLDs are often used in applications requiring glue logic, interface bridging, and simple state machine implementations. They offer advantages such as fast design turnaround, low power consumption, and predictable timing characteristics, making them suitable for a wide range of embedded system designs.