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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Manufacturer Part Number | Type | Lead Free Status | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| LC4512C-5T176C | Lattice Semiconductor | IC CPLD 512MC 5NS 176TQFP | ispMACH® 4000C | 0°C ~ 90°C (TJ) | Tray | Surface Mount | - | - | - | - | 176-LQFP | |
| GAL22V10D-10LJN | Lattice Semiconductor | IC CPLD 10MC 10NS 28PLCC | GAL®22V10 | 0°C ~ 75°C (TA) | Tube | Surface Mount | - | - | - | - | 28-LCC (J-Lead) | |
| M4A3-64/32-12VI48 | Lattice Semiconductor | IC CPLD 64MC 12NS 48TQFP | ispMACH® 4A | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 48-LQFP | |
| XC9536XL-10PC44C | Xilinx | IC CPLD 36MC 10NS 44PLCC | XC9500XL | 0°C ~ 70°C (TA) | Tube | Surface Mount | - | - | - | - | 44-LCC (J-Lead) | |
| LC4064V-75TN48C | Lattice Semiconductor | IC CPLD 64MC 7.5NS 48TQFP | ispMACH® 4000V | 0°C ~ 90°C (TJ) | Tray | Surface Mount | - | - | - | - | 48-LQFP | |
| LC51024VG-10F484C | Lattice Semiconductor | IC CPLD 1024MC 10NS 484FBGA | ispMACH™ 5000VG | 0°C ~ 90°C (TJ) | Tray | Surface Mount | - | - | - | - | 484-BBGA | |
| M4A3-256/128-65YNC | Lattice Semiconductor | IC CPLD 256MC 6.5NS 208QFP | ispMACH® 4A | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 208-BFQFP | |
| EPM7128SQC100-10F | Altera (Intel® Programmable Solutions Group) | IC CPLD 128MC 10NS 100QFP | MAX® 7000S | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 100-BQFP | |
| LC4256V-75FTN256AI | Lattice Semiconductor | IC CPLD 256MC 7.5NS 256FTBGA | ispMACH® 4000V | -40°C ~ 105°C (TJ) | Tray | Surface Mount | - | - | - | - | 256-LBGA | |
| LC4256B-5FTN256BC | Lattice Semiconductor | IC CPLD 256MC 5NS 256FTBGA | ispMACH® 4000B | 0°C ~ 90°C (TJ) | Tray | Surface Mount | - | - | - | - | 256-LBGA |
CPLDs are programmable logic devices that contain configurable logic blocks and interconnects similar to FPGAs but with a smaller capacity and simpler architecture. CPLDs are often used in applications requiring glue logic, interface bridging, and simple state machine implementations. They offer advantages such as fast design turnaround, low power consumption, and predictable timing characteristics, making them suitable for a wide range of embedded system designs.