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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Manufacturer Part Number | Type | Lead Free Status | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| EPM7064STC44-10F | Altera (Intel® Programmable Solutions Group) | IC CPLD 64MC 10NS 44TQFP | MAX® 7000S | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 44-TQFP | |
| M5LV-256/104-12VC | Lattice Semiconductor | IC CPLD 256MC 12NS 144TQFP | MACH® 5 | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 144-LQFP | |
| XCR3032XL-10VQ44C | Xilinx | IC CPLD 32MC 9.1NS 44VQFP | CoolRunner XPLA3 | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 44-TQFP | |
| GAL26CV12C-10LJI | Lattice Semiconductor | IC CPLD 12MC 10NS 28PLCC | GAL®26CV12 | -40°C ~ 85°C (TA) | Tube | Surface Mount | - | - | - | - | 28-LCC (J-Lead) | |
| LC51024MV-75FN672C | Lattice Semiconductor | IC CPLD 1024MC 7.5NS 672FBGA | ispXPLD® 5000MV | 0°C ~ 90°C (TJ) | Tray | Surface Mount | - | - | - | - | 672-BBGA | |
| LC4128C-10T100I | Lattice Semiconductor | IC CPLD 128MC 10NS 100TQFP | ispMACH® 4000C | -40°C ~ 105°C (TJ) | Tray | Surface Mount | - | - | - | - | 100-LQFP | |
| ATF1508ASVL-20JC84 | Micrel / Microchip Technology | IC CPLD 128MC 20NS 84PLCC | ATF15xx | 0°C ~ 70°C (TA) | Tube | Surface Mount | - | - | - | - | 84-LCC (J-Lead) | |
| LC4032ZC-75TN48E | Lattice Semiconductor | IC CPLD 32MC 7.5NS 48TQFP | ispMACH® 4000Z | -40°C ~ 130°C (TJ) | Tray | Surface Mount | - | - | - | - | 48-LQFP | |
| LC4064V-75T48E | Lattice Semiconductor | IC CPLD 64MC 7.5NS 48TQFP | ispMACH® 4000V | -40°C ~ 130°C (TJ) | Tray | Surface Mount | - | - | - | - | 48-LQFP | |
| ATF1504AS-15AC100 | Micrel / Microchip Technology | IC CPLD 64MC 15NS 100TQFP | ATF15xx | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 100-TQFP |
CPLDs are programmable logic devices that contain configurable logic blocks and interconnects similar to FPGAs but with a smaller capacity and simpler architecture. CPLDs are often used in applications requiring glue logic, interface bridging, and simple state machine implementations. They offer advantages such as fast design turnaround, low power consumption, and predictable timing characteristics, making them suitable for a wide range of embedded system designs.