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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Manufacturer Part Number | Type | Lead Free Status | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 5M570ZM100C4N | Intel® FPGAs | IC CPLD 440MC 9NS 100MBGA | MAX® V | 0°C ~ 85°C (TJ) | Tray | Surface Mount | - | - | - | - | 100-TFBGA | |
| CY37064P100-125AC | Cypress Semiconductor | IC CPLD 64MC 10NS 100LQFP | Ultra37000™ | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 100-LQFP | |
| XC2C64A-5QFG48C | Xilinx | IC CPLD 64MC 4.6NS 48QFN | CoolRunner II | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 48-VFQFN Exposed Pad | |
| ATF1504AS-7AX44 | Micrel / Microchip Technology | IC CPLD 64MC 7.5NS 44TQFP | ATF15xx | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 44-TQFP | |
| XCR3128XL-10TQG144I | Xilinx | IC CPLD 128MC 9.1NS 144TQFP | CoolRunner XPLA3 | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 144-LQFP | |
| XC95216-15HQ208I | Xilinx | IC CPLD 216MC 15NS 208HQFP | XC9500 | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 208-BFQFP Exposed Pad | |
| EPM3256AQI208-10N | Altera (Intel® Programmable Solutions Group) | IC CPLD 256MC 10NS 208QFP | MAX® 3000A | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 208-BFQFP | |
| EPM7064LC84-10 | Altera (Intel® Programmable Solutions Group) | IC CPLD 64MC 10NS 84PLCC | MAX® 7000 | 0°C ~ 70°C (TA) | Tube | Surface Mount | - | - | - | - | 84-LCC (J-Lead) | |
| ISPLSI 2032VE-300LT44 | Lattice Semiconductor | IC CPLD 32MC 3NS 44TQFP | ispLSI® 2000VE | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 44-TQFP | |
| LC4256C-5TN176I | Lattice Semiconductor | IC CPLD 256MC 5NS 176TQFP | ispMACH® 4000C | -40°C ~ 105°C (TJ) | Tray | Surface Mount | - | - | - | - | 176-LQFP |
CPLDs are programmable logic devices that contain configurable logic blocks and interconnects similar to FPGAs but with a smaller capacity and simpler architecture. CPLDs are often used in applications requiring glue logic, interface bridging, and simple state machine implementations. They offer advantages such as fast design turnaround, low power consumption, and predictable timing characteristics, making them suitable for a wide range of embedded system designs.