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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Manufacturer Part Number | Type | Lead Free Status | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| XCR3512XL-12FGG324C | 4D Systems | IC CPLD 512MC 10.8NS 324BGA | CoolRunner XPLA3 | 0°C ~ 70°C (TA) | - | Surface Mount | Tray | XCR3512XL-12FGG324C | - | - | - | |
| LC4256C-75FTN256BI | Lattice Semiconductor | IC CPLD 256MC 7.5NS 256FTBGA | ispMACH® 4000C | -40°C ~ 105°C (TJ) | Tray | Surface Mount | - | - | - | - | 256-LBGA | |
| XC9536XL-5VQ64C | Xilinx | IC CPLD 36MC 5NS 64VQFP | XC9500XL | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 64-TQFP | |
| LC4256ZC-75M132I | Lattice Semiconductor | IC CPLD 256MC 7.5NS 132CSBGA | ispMACH® 4000Z | -40°C ~ 105°C (TJ) | Tray | Surface Mount | - | - | - | - | 132-LFBGA, CSPBGA | |
| ISPLSI 2064VE-100LTN44 | Lattice Semiconductor | IC CPLD 64MC 10NS 44TQFP | ispLSI® 2000VE | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 44-TQFP | |
| LC4064V-75TN44C | Lattice Semiconductor | IC CPLD 64MC 7.5NS 44TQFP | ispMACH® 4000V | 0°C ~ 90°C (TJ) | Tray | Surface Mount | - | - | - | - | 44-TQFP | |
| EPM7064LC68-7 | Altera (Intel® Programmable Solutions Group) | IC CPLD 64MC 7.5NS 68PLCC | MAX® 7000 | 0°C ~ 70°C (TA) | Tube | Surface Mount | - | - | - | - | 68-LCC (J-Lead) | |
| EPM570GF256C3 | Intel® FPGAs | IC CPLD 440MC 5.4NS 256FBGA | MAX® II | 0°C ~ 85°C (TJ) | Tray | Surface Mount | - | - | - | - | 256-BGA | |
| XCR3512XL-12PQ208C | Xilinx | IC CPLD 512MC 10.8NS 208QFP | CoolRunner XPLA3 | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 208-BFQFP | |
| EPM7128AETI100-7N | Intel® FPGAs | IC CPLD 128MC 7.5NS 100TQFP | MAX® 7000A | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 100-TQFP |
CPLDs are programmable logic devices that contain configurable logic blocks and interconnects similar to FPGAs but with a smaller capacity and simpler architecture. CPLDs are often used in applications requiring glue logic, interface bridging, and simple state machine implementations. They offer advantages such as fast design turnaround, low power consumption, and predictable timing characteristics, making them suitable for a wide range of embedded system designs.