Loading products…
| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Manufacturer Part Number | Type | Lead Free Status | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| XCR3256XL-12TQ144C | Xilinx | IC CPLD 256MC 10.8NS 144TQFP | CoolRunner XPLA3 | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 144-LQFP | |
| ISPLSI 5256VE-100LB272 | Lattice Semiconductor | IC CPLD 256MC 10NS 272BGA | ispLSI® 5000VE | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 272-BBGA | |
| XC95108-20PQ100I | Xilinx | IC CPLD 108MC 20NS 100QFP | XC9500 | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 100-BQFP | |
| CY37128VP100-83AXCT | Cypress Semiconductor | IC CPLD 128MC 15NS 100LQFP | Ultra37000™ | 0°C ~ 70°C (TA) | Tape & Reel (TR) | Surface Mount | - | - | - | - | 100-LQFP | |
| EPM7032AELC44-4N | Intel® FPGAs | IC CPLD 32MC 4.5NS 44PLCC | MAX® 7000A | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 44-LCC (J-Lead) | |
| ISPLSI 1016-60LJ | Lattice Semiconductor | IC CPLD 64MC 20NS 44PLCC | ispLSI® 1000 | 0°C ~ 70°C (TA) | Tube | Surface Mount | - | - | - | - | 44-LCC (J-Lead) | |
| XC9572XL-7PCG44I | Xilinx | IC CPLD 72MC 7.5NS 44PLCC | XC9500XL | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 44-LCC (J-Lead) | |
| LC4256C-75FTN256AC | Lattice Semiconductor | IC CPLD 256MC 7.5NS 256FTBGA | ispMACH® 4000C | 0°C ~ 90°C (TJ) | Tray | Surface Mount | - | - | - | - | 256-LBGA | |
| XC95288-15HQ208I | Xilinx | IC CPLD 288MC 15NS 208HQFP | XC9500 | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 208-BFQFP Exposed Pad | |
| M4A3-256/160-12YNI | Lattice Semiconductor | IC CPLD 256MC 12NS 208QFP | ispMACH® 4A | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 208-BFQFP |
CPLDs are programmable logic devices that contain configurable logic blocks and interconnects similar to FPGAs but with a smaller capacity and simpler architecture. CPLDs are often used in applications requiring glue logic, interface bridging, and simple state machine implementations. They offer advantages such as fast design turnaround, low power consumption, and predictable timing characteristics, making them suitable for a wide range of embedded system designs.