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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Manufacturer Part Number | Type | Lead Free Status | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GAL16V8D-25LJ | Lattice Semiconductor | IC CPLD 8MC 25NS 20PLCC | GAL®16V8 | 0°C ~ 75°C (TA) | Bulk | Surface Mount | - | - | - | - | 20-LCC (J-Lead) | |
| ISPLSI 2032VE-225LT48 | Lattice Semiconductor | IC CPLD 32MC 4NS 48TQFP | ispLSI® 2000VE | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 48-LQFP | |
| EPM7256AEFC100-10N | Intel® FPGAs | IC CPLD 256MC 10NS 100FBGA | MAX® 7000A | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 100-LBGA | |
| ATF1508AS-10AC100 | Micrel / Microchip Technology | IC CPLD 128MC 10NS 100TQFP | ATF15xx | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 100-TQFP | |
| CY37064P100-125AXI | Cypress Semiconductor | IC CPLD 64MC 10NS 100LQFP | Ultra37000™ | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 100-LQFP | |
| XCR3256XL-10CSG280I | Xilinx | IC CPLD 256MC 9NS 280CSP | CoolRunner XPLA3 | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 280-TFBGA, CSPBGA | |
| XC2C256-6FT256C | Xilinx | IC CPLD 256MC 5.7NS 256BGA | CoolRunner II | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 256-LBGA | |
| EPM1270F256C4N | Altera (Intel® Programmable Solutions Group) | IC CPLD 980MC 6.2NS 256FBGA | MAX® II | 0°C ~ 85°C (TJ) | Tray | Surface Mount | - | - | - | - | 256-BGA | |
| ISPLSI 1016E-80LT44I | Lattice Semiconductor | IC CPLD 64MC 15NS 44TQFP | ispLSI® 1000E | -40°C ~ 85°C (TA) | Bulk | Surface Mount | - | - | - | - | 44-TQFP | |
| LC5512MV-75QN208C | Lattice Semiconductor | IC CPLD 512MC 7.5NS 208QFP | ispXPLD® 5000MV | 0°C ~ 90°C (TJ) | Tray | Surface Mount | - | - | - | - | 208-BFQFP |
CPLDs are programmable logic devices that contain configurable logic blocks and interconnects similar to FPGAs but with a smaller capacity and simpler architecture. CPLDs are often used in applications requiring glue logic, interface bridging, and simple state machine implementations. They offer advantages such as fast design turnaround, low power consumption, and predictable timing characteristics, making them suitable for a wide range of embedded system designs.