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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Manufacturer Part Number | Type | Lead Free Status | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| M5LV-256/104-10VI | Lattice Semiconductor | IC CPLD 256MC 10NS 144TQFP | MACH® 5 | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 144-LQFP | |
| XCR3032XL-5PC44C | Xilinx | IC CPLD 32MC 4.5NS 44PLCC | CoolRunner XPLA3 | 0°C ~ 70°C (TA) | Tube | Surface Mount | - | - | - | - | 44-LCC (J-Lead) | |
| EPM7064LC68-12YY | Altera (Intel® Programmable Solutions Group) | IC CPLD 64MC 12NS 68PLCC | MAX® 7000 | 0°C ~ 70°C (TA) | Tray | - | - | - | - | - | - | |
| ATF750C-10SI | Micrel / Microchip Technology | IC CPLD 10MC 10NS 24SOIC | ATF750C(L) | -40°C ~ 85°C (TA) | Tube | Surface Mount | - | - | - | - | 24-SOIC (0.295", 7.50mm Width) | |
| EPM7096LC84-2S002A | Altera (Intel® Programmable Solutions Group) | IC CPLD 96MC 20NS 84PLCC | MAX® 7000 | 0°C ~ 70°C (TA) | Tray | - | - | - | - | - | - | |
| M5LV-320/120-12YC | Lattice Semiconductor | IC CPLD 320MC 12NS 160QFP | MACH® 5 | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 160-BQFP | |
| CY37064VP100-143AXC | Cypress Semiconductor | IC CPLD 64MC 8.5NS 100LQFP | Ultra37000™ | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 100-LQFP | |
| GAL16V8D-25LJI | Lattice Semiconductor | IC CPLD 8MC 25NS 20PLCC | GAL®16V8 | -40°C ~ 85°C (TA) | Bulk | Surface Mount | - | - | - | - | 20-LCC (J-Lead) | |
| GAL18V10B-15LJ | Lattice Semiconductor | IC CPLD 10MC 15NS 20PLCC | GAL®18V10 | 0°C ~ 75°C (TA) | Tube | Surface Mount | - | - | - | - | 20-LCC (J-Lead) | |
| GAL16V8D-25QJNI | Lattice Semiconductor | IC CPLD 8MC 25NS 20PLCC | GAL®16V8 | -40°C ~ 85°C (TA) | Bulk | Surface Mount | - | - | - | - | 20-LCC (J-Lead) |
CPLDs are programmable logic devices that contain configurable logic blocks and interconnects similar to FPGAs but with a smaller capacity and simpler architecture. CPLDs are often used in applications requiring glue logic, interface bridging, and simple state machine implementations. They offer advantages such as fast design turnaround, low power consumption, and predictable timing characteristics, making them suitable for a wide range of embedded system designs.