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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Manufacturer Part Number | Type | Lead Free Status | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| XC2C128-7VQ100C | Xilinx | IC CPLD 128MC 7NS 100VQFP | CoolRunner II | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 100-TQFP | |
| LC4512V-5TN176C | Lattice Semiconductor | IC CPLD 512MC 5NS 176TQFP | ispMACH® 4000V | 0°C ~ 90°C (TJ) | Tray | Surface Mount | - | - | - | - | 176-LQFP | |
| LC4512C-5FT256I | Lattice Semiconductor | IC CPLD 512MC 5NS 256FTBGA | ispMACH® 4000C | -40°C ~ 105°C (TJ) | Tray | Surface Mount | - | - | - | - | 256-LBGA | |
| EPM570GT144I5 | Intel® FPGAs | IC CPLD 440MC 5.4NS 144TQFP | MAX® II | -40°C ~ 100°C (TJ) | Tray | Surface Mount | - | - | - | - | 144-LQFP | |
| ATF750CL-15PU | Micrel / Microchip Technology | IC CPLD 10MC 15NS 24DIP | ATF750C(L) | -40°C ~ 85°C (TA) | Tube | Through Hole | - | - | - | - | 24-DIP (0.300", 7.62mm) | |
| M5LV-512/256-12SAC | Lattice Semiconductor | IC CPLD 512MC 12NS 352SBGA | MACH® 5 | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 352-LBGA | |
| M4A3-192/96-10VI | Lattice Semiconductor | IC CPLD 192MC 10NS 144TQFP | ispMACH® 4A | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 144-LQFP | |
| M4A3-256/192-12FANI | Lattice Semiconductor | IC CPLD 256MC 12NS 256FBGA | ispMACH® 4A | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 256-BGA | |
| ISPLSI 5256VE-100LF256I | Lattice Semiconductor | IC CPLD 256MC 10NS 256FBGA | ispLSI® 5000VE | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 256-BGA | |
| ATF750LVC-15PI | Micrel / Microchip Technology | IC CPLD 10MC 15NS 24DIP | ATF750LVC | -40°C ~ 85°C (TA) | Tube | Through Hole | - | - | - | - | 24-DIP (0.300", 7.62mm) |
CPLDs are programmable logic devices that contain configurable logic blocks and interconnects similar to FPGAs but with a smaller capacity and simpler architecture. CPLDs are often used in applications requiring glue logic, interface bridging, and simple state machine implementations. They offer advantages such as fast design turnaround, low power consumption, and predictable timing characteristics, making them suitable for a wide range of embedded system designs.