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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Manufacturer Part Number | Type | Lead Free Status | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| LAMXO2280E-3FTN256E | Lattice Semiconductor | IC CPLD 1140MC 5.1NS 256BGA | LA-MachXO | -40°C ~ 125°C (TA) | Tray | Surface Mount | - | - | - | - | 256-LBGA | |
| ATF1502ASV-20JI44 | Micrel / Microchip Technology | IC CPLD 32MC 20NS 44PLCC | ATF15xx | -40°C ~ 85°C (TA) | Tube | Surface Mount | - | - | - | - | 44-LCC (J-Lead) | |
| XA2C384-11TQG144Q | Xilinx | IC CPLD 384MC 9.2NS 144TQFP | CoolRunner II | -40°C ~ 105°C (TA) | Tray | Surface Mount | - | - | - | - | 144-LQFP | |
| M5-256/68-7VI/1 | Lattice Semiconductor | IC CPLD 256MC 7.5NS 100TQFP | MACH® 5 | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 100-LQFP | |
| EPM7256AEFC100-5 | Intel® FPGAs | IC CPLD 256MC 5.5NS 100FBGA | MAX® 7000A | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 100-LBGA | |
| GAL16LV8D-5LJN | Lattice Semiconductor | IC CPLD 8MC 5NS 20PLCC | GAL®16LV8 | 0°C ~ 75°C (TA) | Tube | Surface Mount | - | - | - | - | 20-LCC (J-Lead) | |
| XC2C64A-7QFG48I | Xilinx | IC CPLD 64MC 6.7NS 48QFN | CoolRunner II | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 48-VFQFN Exposed Pad | |
| XC2C64A-5VQG100C | Xilinx | IC CPLD 64MC 4.6NS 100VQFP | CoolRunner II | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 100-TQFP | |
| EPM9480RC208-20 | Altera (Intel® Programmable Solutions Group) | IC CPLD 480MC 20NS 208RQFP | MAX® 9000 | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 208-BFQFP Exposed Pad | |
| XC2C128-7CP132I | Xilinx | IC CPLD 128MC 7NS 132BGA | CoolRunner II | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 132-TFBGA, CSPBGA |
CPLDs are programmable logic devices that contain configurable logic blocks and interconnects similar to FPGAs but with a smaller capacity and simpler architecture. CPLDs are often used in applications requiring glue logic, interface bridging, and simple state machine implementations. They offer advantages such as fast design turnaround, low power consumption, and predictable timing characteristics, making them suitable for a wide range of embedded system designs.