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Embedded - CPLDs (Complex Programmable Logic Devices)

Embedded - CPLDs (Complex Programmable Logic Devices)

  1. Products
  2. Integrated Circuits (ICs)
  3. Embedded - CPLDs (Complex Programmable Logic Devices)
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Image Part Number Manufacturer Description Series Operating Temperature Packaging Mounting Type RoHS Status Manufacturer Part Number Type Lead Free Status Package / Case
EPM7256AEQC208-7N Intel® FPGAs IC CPLD 256MC 7.5NS 208QFP MAX® 7000A 0°C ~ 70°C (TA) Tray Surface Mount - - - - 208-BFQFP
ATV2500BQ-20PC Micrel / Microchip Technology IC CPLD QTR POWER 200NS 40DIP ATV2500B(L) and BQ(L) 0°C ~ 70°C (TA) Tube Through Hole - - - - 40-DIP (0.600", 15.24mm)
LC4032V-75T48C Lattice Semiconductor IC CPLD 32MC 7.5NS 48TQFP ispMACH® 4000V 0°C ~ 90°C (TJ) Tray Surface Mount - - - - 48-LQFP
EPM7128AEFC100-7 Intel® FPGAs IC CPLD 128MC 7.5NS 100FBGA MAX® 7000A 0°C ~ 70°C (TA) Tray Surface Mount - - - - 100-LBGA
ATF1508ASV-15JI84 Micrel / Microchip Technology IC CPLD 128MC 15NS 84PLCC ATF15xx -40°C ~ 85°C (TA) Tube Surface Mount - - - - 84-LCC (J-Lead)
ISPLSI 2128VE-250LTN100 Lattice Semiconductor IC CPLD 128MC 4NS 100TQFP ispLSI® 2000VE 0°C ~ 70°C (TA) Tray Surface Mount - - - - 100-LQFP
EPM3128ATI144-10 Altera (Intel® Programmable Solutions Group) IC CPLD 128MC 10NS 144TQFP MAX® 3000A -40°C ~ 85°C (TA) Tray Surface Mount - - - - 144-LQFP
M4A3-64/64-55VNC Lattice Semiconductor IC CPLD 64MC 5.5NS 100TQFP ispMACH® 4A 0°C ~ 70°C (TA) Tray Surface Mount - - - - 100-LQFP
LC4384C-75TN176C Lattice Semiconductor IC CPLD 384MC 7.5NS 176TQFP ispMACH® 4000C 0°C ~ 90°C (TJ) Tray Surface Mount - - - - 176-LQFP
EPM3064ALC44-7N Altera (Intel® Programmable Solutions Group) IC CPLD 64MC 7.5NS 44PLCC MAX® 3000A 0°C ~ 70°C (TA) Tray Surface Mount - - - - 44-LCC (J-Lead)

About Embedded - CPLDs (Complex Programmable Logic Devices)


CPLDs are programmable logic devices that contain configurable logic blocks and interconnects similar to FPGAs but with a smaller capacity and simpler architecture. CPLDs are often used in applications requiring glue logic, interface bridging, and simple state machine implementations. They offer advantages such as fast design turnaround, low power consumption, and predictable timing characteristics, making them suitable for a wide range of embedded system designs.