Loading products…
| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Manufacturer Part Number | Type | Lead Free Status | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| EPM7064AELC44-4 | Intel® FPGAs | IC CPLD 64MC 4.5NS 44PLCC | MAX® 7000A | 0°C ~ 70°C (TA) | Tube | Surface Mount | - | - | - | - | 44-LCC (J-Lead) | |
| EPM7128AETI144-7N | Intel® FPGAs | IC CPLD 128MC 7.5NS 144TQFP | MAX® 7000A | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 144-LQFP | |
| XC95288XL-10FG256C | Xilinx | IC CPLD 288MC 10NS 256PFBGA | XC9500XL | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 256-BGA | |
| ATF1504ASL-20AC100 | Micrel / Microchip Technology | IC CPLD 64MC 20NS 100TQFP | ATF15xx | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 100-TQFP | |
| EPM7032LC44-10 | Altera (Intel® Programmable Solutions Group) | IC CPLD 32MC 10NS 44PLCC | MAX® 7000 | 0°C ~ 70°C (TA) | Tube | Surface Mount | - | - | - | - | 44-LCC (J-Lead) | |
| ISPLSI 5128VE-100LT128 | Lattice Semiconductor | IC CPLD 128MC 10NS 128TQFP | ispLSI® 5000VE | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 128-LQFP | |
| GAL22V10D-20LJNI | Lattice Semiconductor | IC CPLD 10MC 20NS 28PLCC | GAL®22V10 | -40°C ~ 85°C (TA) | Tube | Surface Mount | - | - | - | - | 28-LCC (J-Lead) | |
| M4A3-512/160-10YI | Lattice Semiconductor | IC CPLD 512MC 10NS 208QFP | ispMACH® 4A | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 208-BFQFP | |
| XCR3256XL-12TQ144I | Xilinx | IC CPLD 256MC 10.8NS 144TQFP | CoolRunner XPLA3 | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 144-LQFP | |
| ATF1508AS-15JI84 | Micrel / Microchip Technology | IC CPLD 128MC 15NS 84PLCC | ATF15xx | -40°C ~ 85°C (TA) | Tube | Surface Mount | - | - | - | - | 84-LCC (J-Lead) |
CPLDs are programmable logic devices that contain configurable logic blocks and interconnects similar to FPGAs but with a smaller capacity and simpler architecture. CPLDs are often used in applications requiring glue logic, interface bridging, and simple state machine implementations. They offer advantages such as fast design turnaround, low power consumption, and predictable timing characteristics, making them suitable for a wide range of embedded system designs.