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Embedded - CPLDs (Complex Programmable Logic Devices)

Embedded - CPLDs (Complex Programmable Logic Devices)

  1. Products
  2. Integrated Circuits (ICs)
  3. Embedded - CPLDs (Complex Programmable Logic Devices)
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Image Part Number Manufacturer Description Series Operating Temperature Packaging Mounting Type RoHS Status Manufacturer Part Number Type Lead Free Status Package / Case
ISPLSI 1016E-100LJ Lattice Semiconductor IC CPLD 64MC 10NS 44PLCC ispLSI® 1000E 0°C ~ 70°C (TA) Tube Surface Mount - - - - 44-LCC (J-Lead)
M5LV-128/68-12VI Lattice Semiconductor IC CPLD 128MC 12NS 100TQFP MACH® 5 -40°C ~ 85°C (TA) Tray Surface Mount - - - - 100-LQFP
ATV2500BQ-25PI Micrel / Microchip Technology IC CPLD QTR POWER 250 NS 40DIP ATV2500B(L) and BQ(L) -40°C ~ 85°C (TA) Tube Through Hole - - - - 40-DIP (0.600", 15.24mm)
EPM7256BUC169-7N Altera (Intel® Programmable Solutions Group) IC CPLD 256MC 7.5NS 169UBGA MAX® 7000B 0°C ~ 70°C (TA) Tray Surface Mount - - - - 160-LFBGA
LC4512V-10TN176I Lattice Semiconductor IC CPLD 512MC 10NS 176TQFP ispMACH® 4000V -40°C ~ 105°C (TJ) Tray Surface Mount - - - - 176-LQFP
ISPLSI 5512VE-100LB388 Lattice Semiconductor IC CPLD 512MC 10NS 388BGA ispLSI® 5000VE 0°C ~ 70°C (TA) Tray Surface Mount - - - - 388-BBGA
ATF1500ABV-15JI Micrel / Microchip Technology IC CPLD 32MC 15NS 44PLCC ATF15xx -40°C ~ 85°C (TA) Tube Surface Mount - - - - 44-LCC (J-Lead)
M4A5-32/32-10VNC48 Lattice Semiconductor IC CPLD 32MC 10NS 48TQFP ispMACH® 4A 0°C ~ 70°C (TA) Tray Surface Mount - - - - 48-LQFP
ISPLSI 5256VE-100LT100 Lattice Semiconductor IC CPLD 256MC 10NS 100TQFP ispLSI® 5000VE 0°C ~ 70°C (TA) Tray Surface Mount - - - - 100-LQFP
LC4512C-5FTN256I Lattice Semiconductor IC CPLD 512MC 5NS 256FTBGA ispMACH® 4000C -40°C ~ 105°C (TJ) Tray Surface Mount - - - - 256-LBGA

About Embedded - CPLDs (Complex Programmable Logic Devices)


CPLDs are programmable logic devices that contain configurable logic blocks and interconnects similar to FPGAs but with a smaller capacity and simpler architecture. CPLDs are often used in applications requiring glue logic, interface bridging, and simple state machine implementations. They offer advantages such as fast design turnaround, low power consumption, and predictable timing characteristics, making them suitable for a wide range of embedded system designs.