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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Manufacturer Part Number | Type | Lead Free Status | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| M4A3-64/32-7VNI | Lattice Semiconductor | IC CPLD 64MC 7.5NS 44TQFP | ispMACH® 4A | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 44-TQFP | |
| XC95108-7PQ160C | Xilinx | IC CPLD 108MC 7.5NS 160QFP | XC9500 | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 160-BQFP | |
| M5LV-256/160-12YI | Lattice Semiconductor | IC CPLD 256MC 12NS 208QFP | MACH® 5 | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 208-BFQFP | |
| ISPLSI 2128VE-250LT176 | Lattice Semiconductor | IC CPLD 128MC 4NS 176TQFP | ispLSI® 2000VE | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 176-LQFP | |
| LC4064ZE-5MN64I | Lattice Semiconductor | IC CPLD 64MC 5.8NS 64CSBGA | ispMACH® 4000ZE | -40°C ~ 105°C (TJ) | Tray | Surface Mount | - | - | - | - | 64-TFBGA, CSPBGA | |
| XC9536-15VQ44C | Xilinx | IC CPLD 36MC 15NS 44VQFP | XC9500 | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 44-TQFP | |
| ISPLSI 2192VE-135LTN128 | Lattice Semiconductor | IC CPLD 192MC 7.5NS 128TQFP | ispLSI® 2000VE | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 128-LQFP | |
| ATF1508AS-7QC100 | Micrel / Microchip Technology | IC CPLD 128MC 7.5NS 100QFP | ATF15xx | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 100-BQFP | |
| EPM7160ELC84-12 | Altera (Intel® Programmable Solutions Group) | IC CPLD 160MC 12NS 84PLCC | MAX® 7000 | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 84-LCC (J-Lead) | |
| LC4384V-5TN176C | Lattice Semiconductor | IC CPLD 384MC 5NS 176TQFP | ispMACH® 4000V | 0°C ~ 90°C (TJ) | Tray | Surface Mount | - | - | - | - | 176-LQFP |
CPLDs are programmable logic devices that contain configurable logic blocks and interconnects similar to FPGAs but with a smaller capacity and simpler architecture. CPLDs are often used in applications requiring glue logic, interface bridging, and simple state machine implementations. They offer advantages such as fast design turnaround, low power consumption, and predictable timing characteristics, making them suitable for a wide range of embedded system designs.