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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Manufacturer Part Number | Type | Lead Free Status | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| XCR3256XL-12CS280C | 4D Systems | IC CPLD 256MC 10.8NS 280CSP | CoolRunner XPLA3 | 0°C ~ 70°C (TA) | - | Surface Mount | Tray | XCR3256XL-12CS280C | - | - | - | |
| EPM7192EQC160-15YY | Altera (Intel® Programmable Solutions Group) | IC CPLD 192MC 15NS 160QFP | MAX® 7000 | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 160-BQFP | |
| ATF1504ASVL-20QI100 | Micrel / Microchip Technology | IC CPLD 64MC 20NS 100QPFP | ATF15xx | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 100-BQFP | |
| LC4256C-5TN100I | Lattice Semiconductor | IC CPLD 256MC 5NS 100TQFP | ispMACH® 4000C | -40°C ~ 105°C (TJ) | Tray | Surface Mount | - | - | - | - | 100-LQFP | |
| GAL16LV8C-10LJN | Lattice Semiconductor | IC CPLD 8MC 10NS 20PLCC | GAL®16LV8 | 0°C ~ 75°C (TA) | Tube | Surface Mount | - | - | - | - | 20-LCC (J-Lead) | |
| XC2C32A-6VQ44C | Xilinx | IC CPLD 32MC 5.5NS 44VQFP | CoolRunner II | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 44-TQFP | |
| GAL16V8D-15QP | Lattice Semiconductor | IC CPLD 8MC 15NS 20DIP | GAL®16V8 | 0°C ~ 75°C (TA) | Bulk | Through Hole | - | - | - | - | 20-DIP (0.300", 7.62mm) | |
| M4A5-64/32-55JNC | Lattice Semiconductor | IC CPLD 64MC 5.5NS 44PLCC | ispMACH® 4A | 0°C ~ 70°C (TA) | Tube | Surface Mount | - | - | - | - | 44-LCC (J-Lead) | |
| LC4384C-10TN176I | Lattice Semiconductor | IC CPLD 384MC 10NS 176TQFP | ispMACH® 4000C | -40°C ~ 105°C (TJ) | Tray | Surface Mount | - | - | - | - | 176-LQFP | |
| M4A3-64/32-10VNI48 | Lattice Semiconductor | IC CPLD 64MC 10NS 48TQFP | ispMACH® 4A | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 48-LQFP |
CPLDs are programmable logic devices that contain configurable logic blocks and interconnects similar to FPGAs but with a smaller capacity and simpler architecture. CPLDs are often used in applications requiring glue logic, interface bridging, and simple state machine implementations. They offer advantages such as fast design turnaround, low power consumption, and predictable timing characteristics, making them suitable for a wide range of embedded system designs.