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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Manufacturer Part Number | Type | Lead Free Status | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| XCR3064XL-6VQ100C | Xilinx | IC CPLD 64MC 5.5NS 100VQFP | CoolRunner XPLA3 | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 100-TQFP | |
| XCR3256XL-12CSG280I | Xilinx | IC CPLD 256MC 10.8NS 280CSP | CoolRunner XPLA3 | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 280-TFBGA, CSPBGA | |
| LC51024VG-75F676C | Lattice Semiconductor | IC CPLD 1024MC 7.5NS 676FBGA | ispMACH™ 5000VG | 0°C ~ 90°C (TJ) | Tray | Surface Mount | - | - | - | - | 676-BBGA | |
| EPM7256AETC100-7 | Intel® FPGAs | IC CPLD 256MC 7.5NS 100TQFP | MAX® 7000A | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 100-TQFP | |
| LC4032ZE-5TN48C | Lattice Semiconductor | IC CPLD 32MC 5.8NS 48TQFP | ispMACH® 4000ZE | 0°C ~ 90°C (TJ) | Tray | Surface Mount | - | - | - | - | 48-LQFP | |
| ISPLSI 2096E-180LT128 | Lattice Semiconductor | IC CPLD 96MC 5NS 128TQFP | ispLSI® 2000E | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 128-LQFP | |
| M4A3-256/160-10YI | Lattice Semiconductor | IC CPLD 256MC 10NS 208QFP | ispMACH® 4A | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 208-BFQFP | |
| ATF1502ASL-25AU44 | Micrel / Microchip Technology | IC CPLD 32MC 25NS 44TQFP | ATF15xx | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 44-TQFP | |
| CY37064VP44-100AXCT | Cypress Semiconductor | IC CPLD 64MC 12NS 44LQFP | Ultra37000™ | 0°C ~ 70°C (TA) | Tape & Reel (TR) | Surface Mount | - | - | - | - | 44-LQFP | |
| M4A3-32/32-5VC48 | Lattice Semiconductor | IC CPLD 32MC 5NS 48TQFP | ispMACH® 4A | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 48-LQFP |
CPLDs are programmable logic devices that contain configurable logic blocks and interconnects similar to FPGAs but with a smaller capacity and simpler architecture. CPLDs are often used in applications requiring glue logic, interface bridging, and simple state machine implementations. They offer advantages such as fast design turnaround, low power consumption, and predictable timing characteristics, making them suitable for a wide range of embedded system designs.