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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Manufacturer Part Number | Type | Lead Free Status | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| M5LV-384/160-10YI | Lattice Semiconductor | IC CPLD 384MC 10NS 208QFP | MACH® 5 | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 208-BFQFP | |
| ISPLSI 5256VA-70LQ208 | Lattice Semiconductor | IC CPLD 256MC 15NS 208QFP | ispLSI® 5000VA | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 208-BFQFP | |
| EPM7128AEFC100-5 | Intel® FPGAs | IC CPLD 128MC 5NS 100FBGA | MAX® 7000A | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 100-LBGA | |
| GAL16V8D-15LJI | Lattice Semiconductor | IC CPLD 8MC 15NS 20PLCC | GAL®16V8 | -40°C ~ 85°C (TA) | Bulk | Surface Mount | - | - | - | - | 20-LCC (J-Lead) | |
| ATF1504ASV-15JU44 | Micrel / Microchip Technology | IC CPLD 64MC 15NS 44PLCC | ATF15xx | -40°C ~ 85°C (TA) | Tube | Surface Mount | - | - | - | - | 44-LCC (J-Lead) | |
| ATF1500AL-20JC | Micrel / Microchip Technology | IC CPLD 32MC 20NS 44PLCC | ATF15xx | 0°C ~ 70°C (TA) | Tube | Surface Mount | - | - | - | - | 44-LCC (J-Lead) | |
| LC4256ZE-5TN144C | Lattice Semiconductor | IC CPLD 256MC 5.8NS 144TQFP | ispMACH® 4000ZE | 0°C ~ 90°C (TJ) | Tray | Surface Mount | - | - | - | - | 144-LQFP | |
| EPM7128AETC100-7 | Intel® FPGAs | IC CPLD 128MC 7.5NS 100TQFP | MAX® 7000A | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 100-TQFP | |
| ATF750C-15PI | Micrel / Microchip Technology | IC CPLD 10MC 15NS 24DIP | ATF750C(L) | -40°C ~ 85°C (TA) | Tube | Through Hole | - | - | - | - | 24-DIP (0.300", 7.62mm) | |
| ATF1504AS-7QC100 | Micrel / Microchip Technology | IC CPLD 64MC 7.5NS 100QFP | ATF15xx | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 100-BQFP |
CPLDs are programmable logic devices that contain configurable logic blocks and interconnects similar to FPGAs but with a smaller capacity and simpler architecture. CPLDs are often used in applications requiring glue logic, interface bridging, and simple state machine implementations. They offer advantages such as fast design turnaround, low power consumption, and predictable timing characteristics, making them suitable for a wide range of embedded system designs.