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Embedded - CPLDs (Complex Programmable Logic Devices)

Embedded - CPLDs (Complex Programmable Logic Devices)

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  2. Integrated Circuits (ICs)
  3. Embedded - CPLDs (Complex Programmable Logic Devices)
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Image Part Number Manufacturer Description Series Operating Temperature Packaging Mounting Type RoHS Status Manufacturer Part Number Type Lead Free Status Package / Case
XC2C256-7CP132C Xilinx IC CPLD 256MC 6.7NS 132BGA CoolRunner II 0°C ~ 70°C (TA) Tray Surface Mount - - - - 132-TFBGA, CSPBGA
EPM7256EGI192-20 Altera (Intel® Programmable Solutions Group) IC CPLD 256MC 20NS 192PGA MAX® 7000 -40°C ~ 85°C (TA) Tray Surface Mount - - - - 192-BPGA
LC4512V-35TN176C Lattice Semiconductor IC CPLD 512MC 3.5NS 176TQFP ispMACH® 4000V 0°C ~ 90°C (TJ) Tray Surface Mount - - - - 176-LQFP
EPM7064LI68-15 Altera (Intel® Programmable Solutions Group) IC CPLD 64MC 15NS 68PLCC MAX® 7000 -40°C ~ 85°C (TA) Tube Surface Mount - - - - 68-LCC (J-Lead)
EPM7128BTC144-10 Altera (Intel® Programmable Solutions Group) IC CPLD 128MC 10NS 144TQFP MAX® 7000B 0°C ~ 70°C (TA) Tray Surface Mount - - - - 144-LQFP
XCR3064XL-10PC44I Xilinx IC CPLD 64MC 9.1NS 44PLCC CoolRunner XPLA3 -40°C ~ 85°C (TA) Tube Surface Mount - - - - 44-LCC (J-Lead)
XC2C384-10PQG208C Xilinx IC CPLD 384MC 9.2NS 208QFP CoolRunner II 0°C ~ 70°C (TA) Tray Surface Mount - - - - 208-BFQFP
GAL16V8D-20QPI Lattice Semiconductor IC CPLD 8MC 20NS 20DIP GAL®16V8 -40°C ~ 85°C (TA) Bulk Through Hole - - - - 20-DIP (0.300", 7.62mm)
ATF750C-7SC Micrel / Microchip Technology IC CPLD 10MC 7.5NS 24SOIC ATF750C(L) 0°C ~ 70°C (TA) Tube Surface Mount - - - - 24-SOIC (0.295", 7.50mm Width)
EPM7128AEFC256-7 Altera (Intel® Programmable Solutions Group) IC CPLD 128MC 7.5NS 256FBGA MAX® 7000A 0°C ~ 70°C (TA) Tray Surface Mount - - - - 256-BGA

About Embedded - CPLDs (Complex Programmable Logic Devices)


CPLDs are programmable logic devices that contain configurable logic blocks and interconnects similar to FPGAs but with a smaller capacity and simpler architecture. CPLDs are often used in applications requiring glue logic, interface bridging, and simple state machine implementations. They offer advantages such as fast design turnaround, low power consumption, and predictable timing characteristics, making them suitable for a wide range of embedded system designs.