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Embedded - CPLDs (Complex Programmable Logic Devices)

Embedded - CPLDs (Complex Programmable Logic Devices)

  1. Products
  2. Integrated Circuits (ICs)
  3. Embedded - CPLDs (Complex Programmable Logic Devices)
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Image Part Number Manufacturer Description Series Operating Temperature Packaging Mounting Type RoHS Status Manufacturer Part Number Type Lead Free Status Package / Case
GAL26V12C-15LJ Lattice Semiconductor IC CPLD 12MC 15NS 28PLCC GAL®26V12 0°C ~ 75°C (TA) Tube Surface Mount - - - - 28-LCC (J-Lead)
GAL20V8B-15LP Lattice Semiconductor IC CPLD 8MC 15NS 24DIP GAL®20V8 0°C ~ 75°C (TA) Tube Through Hole - - - - 24-DIP (0.300", 7.62mm)
GAL16V8D-25QPNI Lattice Semiconductor IC CPLD 8MC 25NS 20DIP GAL®16V8 -40°C ~ 85°C (TA) Bulk Through Hole - - - - 20-DIP (0.300", 7.62mm)
5M1270ZF256C5N Altera (Intel® Programmable Solutions Group) IC CPLD 980MC 6.2NS 256FBGA MAX® V 0°C ~ 85°C (TJ) Tray Surface Mount - - - - 256-LBGA
EPM7512AETC144-12 Altera (Intel® Programmable Solutions Group) IC CPLD 512MC 12NS 144TQFP MAX® 7000A 0°C ~ 70°C (TA) Tray Surface Mount - - - - 144-LQFP
EPM1270T144I5 Altera (Intel® Programmable Solutions Group) IC CPLD 980MC 6.2NS 144TQFP MAX® II -40°C ~ 100°C (TJ) Tray Surface Mount - - - - 144-LQFP
XC95108-20PQ100C Xilinx IC CPLD 108MC 20NS 100QFP XC9500 0°C ~ 70°C (TA) Tray Surface Mount - - - - 100-BQFP
ATF2500C-20JI Micrel / Microchip Technology IC CPLD 24MC 20NS 44PLCC ATF2500C(L) -40°C ~ 85°C (TA) Tube Surface Mount - - - - 44-LCC (J-Lead)
EPM7128BFC100-10 Altera (Intel® Programmable Solutions Group) IC CPLD 128MC 10NS 100FBGA MAX® 7000B 0°C ~ 70°C (TA) Tray Surface Mount - - - - 100-LBGA
ATV2500BL-20KI Micrel / Microchip Technology IC CPLD 25NS CERAMIC 44JLCC ATV2500B(L) and BQ(L) -40°C ~ 85°C (TA) Tube Surface Mount - - - - 44-CLCC, Window (J-Lead)

About Embedded - CPLDs (Complex Programmable Logic Devices)


CPLDs are programmable logic devices that contain configurable logic blocks and interconnects similar to FPGAs but with a smaller capacity and simpler architecture. CPLDs are often used in applications requiring glue logic, interface bridging, and simple state machine implementations. They offer advantages such as fast design turnaround, low power consumption, and predictable timing characteristics, making them suitable for a wide range of embedded system designs.