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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Manufacturer Part Number | Type | Lead Free Status | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| XC9536XL-10VQG44I | Xilinx | IC CPLD 36MC 10NS 44VQFP | XC9500XL | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 44-TQFP | |
| XC9536XL-10VQ64C | Xilinx | IC CPLD 36MC 10NS 64VQFP | XC9500XL | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 64-TQFP | |
| XCR3064XL-6CP56C | Xilinx | IC CPLD 64MC 5.5NS 56CSP | CoolRunner XPLA3 | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 56-LFBGA, CSPBGA | |
| LC4256V-3TN176C | Lattice Semiconductor | IC CPLD 256MC 3NS 176TQFP | ispMACH® 4000V | 0°C ~ 90°C (TJ) | Tray | Surface Mount | - | - | - | - | 176-LQFP | |
| ISPLSI 5256VE-165LF256 | Lattice Semiconductor | IC CPLD 256MC 6NS 256FBGA | ispLSI® 5000VE | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 256-BGA | |
| M4A5-32/32-10VC48 | Lattice Semiconductor | IC CPLD 32MC 10NS 48TQFP | ispMACH® 4A | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 48-LQFP | |
| ISPLSI 1016E-125LJN | Lattice Semiconductor | IC CPLD 64MC 7.5NS 44PLCC | ispLSI® 1000E | 0°C ~ 70°C (TA) | Tube | Surface Mount | - | - | - | - | 44-LCC (J-Lead) | |
| EPM7032LC44-15 | Altera (Intel® Programmable Solutions Group) | IC CPLD 32MC 15NS 44PLCC | MAX® 7000 | 0°C ~ 70°C (TA) | Tube | Surface Mount | - | - | - | - | 44-LCC (J-Lead) | |
| EPM1270T144C5N | Altera (Intel® Programmable Solutions Group) | IC CPLD 980MC 6.2NS 144TQFP | MAX® II | 0°C ~ 85°C (TJ) | Tray | Surface Mount | - | - | - | - | 144-LQFP | |
| LC4064C-75TN48C | Lattice Semiconductor | IC CPLD 64MC 7.5NS 48TQFP | ispMACH® 4000C | 0°C ~ 90°C (TJ) | Tray | Surface Mount | - | - | - | - | 48-LQFP |
CPLDs are programmable logic devices that contain configurable logic blocks and interconnects similar to FPGAs but with a smaller capacity and simpler architecture. CPLDs are often used in applications requiring glue logic, interface bridging, and simple state machine implementations. They offer advantages such as fast design turnaround, low power consumption, and predictable timing characteristics, making them suitable for a wide range of embedded system designs.