Loading products…
| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Manufacturer Part Number | Type | Lead Free Status | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| EPM7032LC44-6 | Altera (Intel® Programmable Solutions Group) | IC CPLD 32MC 6NS 44PLCC | MAX® 7000 | 0°C ~ 70°C (TA) | Tube | Surface Mount | - | - | - | - | 44-LCC (J-Lead) | |
| M5-512/256-12SAI | Lattice Semiconductor | IC CPLD 512MC 12NS 352SBGA | MACH® 5 | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 352-LBGA | |
| LC4256V-75TN176I | Lattice Semiconductor | IC CPLD 256MC 7.5NS 176TQFP | ispMACH® 4000V | -40°C ~ 105°C (TJ) | Tray | Surface Mount | - | - | - | - | 176-LQFP | |
| XCR3064XL-10VQ44I | Xilinx | IC CPLD 64MC 9.1NS 44VQFP | CoolRunner XPLA3 | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 44-TQFP | |
| EPM7128EQC100-7YY | Altera (Intel® Programmable Solutions Group) | IC CPLD 128MC 7.5NS 100QFP | MAX® 7000 | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 100-BQFP | |
| CY37256P208-125NXI | Cypress Semiconductor | IC CPLD 256MC 10NS 208BQFP | Ultra37000™ | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 208-BFQFP | |
| EPM3512AQC208-7 | Altera (Intel® Programmable Solutions Group) | IC CPLD 512MC 7.5NS 208QFP | MAX® 3000A | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 208-BFQFP | |
| XC9536XL-5PCG44C | Xilinx | IC CPLD 36MC 5NS 44PLCC | XC9500XL | 0°C ~ 70°C (TA) | Tube | Surface Mount | - | - | - | - | 44-LCC (J-Lead) | |
| LC4256V-3T176C | Lattice Semiconductor | IC CPLD 256MC 3NS 176TQFP | ispMACH® 4000V | 0°C ~ 90°C (TJ) | Tray | Surface Mount | - | - | - | - | 176-LQFP | |
| XC9572XL-5VQG44C | Xilinx | IC CPLD 72MC 5NS 44VQFP | XC9500XL | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 44-TQFP |
CPLDs are programmable logic devices that contain configurable logic blocks and interconnects similar to FPGAs but with a smaller capacity and simpler architecture. CPLDs are often used in applications requiring glue logic, interface bridging, and simple state machine implementations. They offer advantages such as fast design turnaround, low power consumption, and predictable timing characteristics, making them suitable for a wide range of embedded system designs.