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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Manufacturer Part Number | Type | Lead Free Status | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| CY37064VP44-100AXC | Cypress Semiconductor | IC CPLD 64MC 12NS 44LQFP | Ultra37000™ | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 44-LQFP | |
| M5LV-512/160-7YI | Lattice Semiconductor | IC CPLD 512MC 7.5NS 208QFP | MACH® 5 | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 208-BFQFP | |
| LC4064ZC-5T48C | Lattice Semiconductor | IC CPLD 64MC 5NS 48TQFP | ispMACH® 4000Z | 0°C ~ 90°C (TJ) | Tray | Surface Mount | - | - | - | - | 48-LQFP | |
| M5-512/160-7YC | Lattice Semiconductor | IC CPLD 512MC 7.5NS 208QFP | MACH® 5 | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 208-BFQFP | |
| XC95216-20PQG160C | Xilinx | IC CPLD 216MC 20NS 160QFP | XC9500 | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 160-BQFP | |
| LC4256C-5T100C | Lattice Semiconductor | IC CPLD 256MC 5NS 100TQFP | ispMACH® 4000C | 0°C ~ 90°C (TJ) | Tray | Surface Mount | - | - | - | - | 100-LQFP | |
| LC4032V-75T44E | Lattice Semiconductor | IC CPLD 32MC 7.5NS 44TQFP | ispMACH® 4000V | -40°C ~ 130°C (TJ) | Tray | Surface Mount | - | - | - | - | 44-TQFP | |
| XC9572XL-7PC44C | Xilinx | IC CPLD 72MC 7.5NS 44PLCC | XC9500XL | 0°C ~ 70°C (TA) | Tube | Surface Mount | - | - | - | - | 44-LCC (J-Lead) | |
| ATV2500BQ-20DC | Micrel / Microchip Technology | IC CPLD QTR POWER 200NS 40CDIP | ATV2500B(L) and BQ(L) | 0°C ~ 70°C (TA) | Tube | Through Hole | - | - | - | - | 40-CDIP (0.600", 15.24mm) Window | |
| EPM7032AETA44-10N | Intel® FPGAs | IC CPLD 32MC 10NS 44TQFP | MAX® 7000A | -40°C ~ 130°C (TJ) | Tray | Surface Mount | - | - | - | - | 44-TQFP |
CPLDs are programmable logic devices that contain configurable logic blocks and interconnects similar to FPGAs but with a smaller capacity and simpler architecture. CPLDs are often used in applications requiring glue logic, interface bridging, and simple state machine implementations. They offer advantages such as fast design turnaround, low power consumption, and predictable timing characteristics, making them suitable for a wide range of embedded system designs.