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Embedded - CPLDs (Complex Programmable Logic Devices)

Embedded - CPLDs (Complex Programmable Logic Devices)

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  2. Integrated Circuits (ICs)
  3. Embedded - CPLDs (Complex Programmable Logic Devices)
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Image Part Number Manufacturer Description Series Operating Temperature Packaging Mounting Type RoHS Status Manufacturer Part Number Type Lead Free Status Package / Case
LC4064ZE-5MN64C Lattice Semiconductor IC CPLD 64MC 5.8NS 64CSBGA ispMACH® 4000ZE 0°C ~ 90°C (TJ) Tray Surface Mount - - - - 64-TFBGA, CSPBGA
EPM7128SQCI100-10 Altera (Intel® Programmable Solutions Group) IC CPLD 128MC 10NS 100QFP MAX® 7000S -40°C ~ 85°C (TA) Tray - - - - - -
ATV2500BQL-25KC Micrel / Microchip Technology IC CPLD QTR PW L 25NS CER 44JLCC ATV2500B(L) and BQ(L) 0°C ~ 70°C (TA) Tube Surface Mount - - - - 44-CLCC, Window (J-Lead)
EPM7064LI84-15 Altera (Intel® Programmable Solutions Group) IC CPLD 64MC 15NS 84PLCC MAX® 7000 -40°C ~ 85°C (TA) Tube Surface Mount - - - - 84-LCC (J-Lead)
EPM240ZM100C6N Intel® FPGAs IC CPLD 192MC 7.5NS 100MBGA MAX® II 0°C ~ 85°C (TJ) Tray Surface Mount - - - - 100-TFBGA
ISPLSI 5256VE-125LT128I Lattice Semiconductor IC CPLD 256MC 7.5NS 128TQFP ispLSI® 5000VE -40°C ~ 85°C (TA) Tray Surface Mount - - - - 128-LQFP
XCR3256XL-12CS280C 4D Systems IC CPLD 256MC 10.8NS 280CSP CoolRunner XPLA3 0°C ~ 70°C (TA) - Surface Mount Tray XCR3256XL-12CS280C - - -
EPM7192EQC160-15YY Altera (Intel® Programmable Solutions Group) IC CPLD 192MC 15NS 160QFP MAX® 7000 0°C ~ 70°C (TA) Tray Surface Mount - - - - 160-BQFP
ATF1504ASVL-20QI100 Micrel / Microchip Technology IC CPLD 64MC 20NS 100QPFP ATF15xx -40°C ~ 85°C (TA) Tray Surface Mount - - - - 100-BQFP
LC4256C-5TN100I Lattice Semiconductor IC CPLD 256MC 5NS 100TQFP ispMACH® 4000C -40°C ~ 105°C (TJ) Tray Surface Mount - - - - 100-LQFP

About Embedded - CPLDs (Complex Programmable Logic Devices)


CPLDs are programmable logic devices that contain configurable logic blocks and interconnects similar to FPGAs but with a smaller capacity and simpler architecture. CPLDs are often used in applications requiring glue logic, interface bridging, and simple state machine implementations. They offer advantages such as fast design turnaround, low power consumption, and predictable timing characteristics, making them suitable for a wide range of embedded system designs.