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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Manufacturer Part Number | Type | Lead Free Status | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| EPM7064AETI44-7 | Intel® FPGAs | IC CPLD 64MC 7.5NS 44TQFP | MAX® 7000A | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 44-TQFP | |
| XC95216-10BG352C | Xilinx | IC CPLD 216MC 10NS 352BGA | XC9500 | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 352-LBGA Exposed Pad, Metal | |
| EPM7160STC100-10N | Altera (Intel® Programmable Solutions Group) | IC CPLD 160MC 10NS 100TQFP | MAX® 7000S | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 100-TQFP | |
| EPM240ZM68C6N | Intel® FPGAs | IC CPLD 192MC 7.5NS 68MBGA | MAX® II | 0°C ~ 85°C (TJ) | Tray | Surface Mount | - | - | - | - | 68-TFBGA | |
| XC9572XL-7VQ44C | Xilinx | IC CPLD 72MC 7.5NS 44VQFP | XC9500XL | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 44-TQFP | |
| LC4064ZE-5TN100C | Lattice Semiconductor | IC CPLD 64MC 5.8NS 100TQFP | ispMACH® 4000ZE | 0°C ~ 90°C (TJ) | Tray | Surface Mount | - | - | - | - | 100-LQFP | |
| EPM7032STC44-10N | Altera (Intel® Programmable Solutions Group) | IC CPLD 32MC 10NS 44TQFP | MAX® 7000S | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 44-TQFP | |
| EPM7128BTC100-4N | Altera (Intel® Programmable Solutions Group) | IC CPLD 128MC 4NS 100TQFP | MAX® 7000B | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 100-TQFP | |
| CY37512VP256-66BGC | Cypress Semiconductor | IC CPLD 512MC 20NS 292BGA | Ultra37000™ | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 292-BGA | |
| LC4256B-10F256BI | Lattice Semiconductor | IC CPLD 256MC 10NS 256FBGA | ispMACH® 4000B | -40°C ~ 105°C (TJ) | Tray | Surface Mount | - | - | - | - | 256-BGA |
CPLDs are programmable logic devices that contain configurable logic blocks and interconnects similar to FPGAs but with a smaller capacity and simpler architecture. CPLDs are often used in applications requiring glue logic, interface bridging, and simple state machine implementations. They offer advantages such as fast design turnaround, low power consumption, and predictable timing characteristics, making them suitable for a wide range of embedded system designs.