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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Manufacturer Part Number | Type | Lead Free Status | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| XCR3064XL-6CS48C | Xilinx | IC CPLD 64MC 5.5NS 48CSP | CoolRunner XPLA3 | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 48-FBGA, CSPBGA | |
| LC4032ZC-75T48C | Lattice Semiconductor | IC CPLD 32MC 7.5NS 48TQFP | ispMACH® 4000Z | 0°C ~ 90°C (TJ) | Tray | Surface Mount | - | - | - | - | 48-LQFP | |
| ISPLSI 2096VE-200LT128 | Lattice Semiconductor | IC CPLD 96MC 4.5NS 128TQFP | ispLSI® 2000VE | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 128-LQFP | |
| ISPLSI 5512VE-100LF256 | Lattice Semiconductor | IC CPLD 512MC 10NS 256FBGA | ispLSI® 5000VE | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 256-BGA | |
| M5LV-512/160-10YI | Lattice Semiconductor | IC CPLD 512MC 10NS 208QFP | MACH® 5 | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 208-BFQFP | |
| EPM3064ALC44-10N | Altera (Intel® Programmable Solutions Group) | IC CPLD 64MC 10NS 44PLCC | MAX® 3000A | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 44-LCC (J-Lead) | |
| XC2C256-7CPG132I | Xilinx | IC CPLD 256MC 6.7NS 132CSBGA | CoolRunner II | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 132-TFBGA, CSPBGA | |
| XC95288XV-7TQ144C | Xilinx | IC CPLD 288MC 7.5NS 144TQFP | XC9500XV | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 144-LQFP | |
| XCR3064XL-6VQ100C | Xilinx | IC CPLD 64MC 5.5NS 100VQFP | CoolRunner XPLA3 | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 100-TQFP | |
| XCR3256XL-12CSG280I | Xilinx | IC CPLD 256MC 10.8NS 280CSP | CoolRunner XPLA3 | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 280-TFBGA, CSPBGA |
CPLDs are programmable logic devices that contain configurable logic blocks and interconnects similar to FPGAs but with a smaller capacity and simpler architecture. CPLDs are often used in applications requiring glue logic, interface bridging, and simple state machine implementations. They offer advantages such as fast design turnaround, low power consumption, and predictable timing characteristics, making them suitable for a wide range of embedded system designs.