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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Manufacturer Part Number | Type | Lead Free Status | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| LC4512B-10FT256I | Lattice Semiconductor | IC CPLD 512MC 10NS 256FTBGA | ispMACH® 4000B | -40°C ~ 105°C (TJ) | Tray | Surface Mount | - | - | - | - | 256-LBGA | |
| XCR3032XL-7CS48I | Xilinx | IC CPLD 32MC 7NS 48CSA | CoolRunner XPLA3 | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 48-FBGA, CSPBGA | |
| M4A5-32/32-10VC | Lattice Semiconductor | IC CPLD 32MC 10NS 44TQFP | ispMACH® 4A | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 44-TQFP | |
| M5-256/160-12YI/1 | Lattice Semiconductor | IC CPLD 256MC 12NS 208QFP | MACH® 5 | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 208-BFQFP | |
| 5M2210ZF324I5N | Altera (Intel® Programmable Solutions Group) | IC CPLD 1700MC 7NS 324FBGA | MAX® V | -40°C ~ 100°C (TJ) | Tray | Surface Mount | - | - | - | - | 324-LBGA | |
| 5M80ZE64A5N | Intel® FPGAs | IC CPLD 64MC 7.5NS 64EQFP | MAX® V | -40°C ~ 125°C (TJ) | Tray | Surface Mount | - | - | - | - | 64-TQFP Exposed Pad | |
| LC4256V-75T100I | Lattice Semiconductor | IC CPLD 256MC 7.5NS 100TQFP | ispMACH® 4000V | -40°C ~ 105°C (TJ) | Tray | Surface Mount | - | - | - | - | 100-LQFP | |
| M4A3-32/32-10JC | Lattice Semiconductor | IC CPLD 32MC 10NS 44PLCC | ispMACH® 4A | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 44-LCC (J-Lead) | |
| EPM7128ELC84-7MM | Altera (Intel® Programmable Solutions Group) | IC CPLD 128MC 7.5NS 84PLCC | MAX® 7000 | 0°C ~ 70°C (TA) | Tray | - | - | - | - | - | - | |
| LC5512MC-75QN208C | Lattice Semiconductor | IC CPLD 512MC 7.5NS 208QFP | ispXPLD® 5000MC | 0°C ~ 90°C (TJ) | Tray | Surface Mount | - | - | - | - | 208-BFQFP |
CPLDs are programmable logic devices that contain configurable logic blocks and interconnects similar to FPGAs but with a smaller capacity and simpler architecture. CPLDs are often used in applications requiring glue logic, interface bridging, and simple state machine implementations. They offer advantages such as fast design turnaround, low power consumption, and predictable timing characteristics, making them suitable for a wide range of embedded system designs.