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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Manufacturer Part Number | Type | Lead Free Status | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| LC4064B-5T44I | Lattice Semiconductor | IC CPLD 64MC 5NS 44TQFP | ispMACH® 4000B | -40°C ~ 105°C (TJ) | Tray | Surface Mount | - | - | - | - | 44-TQFP | |
| M4A3-256/160-10YNI | Lattice Semiconductor | IC CPLD 256MC 10NS 208QFP | ispMACH® 4A | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 208-BFQFP | |
| ISPLSI 1032E-70LTN | Lattice Semiconductor | IC CPLD 128MC 15NS 100TQFP | ispLSI® 1000E | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 100-LQFP | |
| XC9536XL-7CS48C | Xilinx | IC CPLD 36MC 7.5NS 48CSBGA | XC9500XL | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 48-FBGA, CSPBGA | |
| M5LV-512/160-15YC | Lattice Semiconductor | IC CPLD 512MC 15NS 208QFP | MACH® 5 | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 208-BFQFP | |
| LC51024MV-75FN484I | Lattice Semiconductor | IC CPLD 1024MC 7.5NS 484FBGA | ispXPLD® 5000MV | -40°C ~ 105°C (TJ) | Tray | Surface Mount | - | - | - | - | 484-BBGA | |
| GAL22V10D-25QPN | Lattice Semiconductor | IC CPLD 10MC 25NS 24DIP | GAL®22V10 | 0°C ~ 75°C (TA) | Tube | Through Hole | - | - | - | - | 24-DIP (0.300", 7.62mm) | |
| XCR3512XL-10FT256I | Xilinx | IC CPLD 512MC 9NS 256BGA | CoolRunner XPLA3 | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 256-LBGA | |
| EPM7064AEFC100-10N | Intel® FPGAs | IC CPLD 64MC 10NS 100FBGA | MAX® 7000A | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 100-LBGA | |
| ATF1500A-10AI | Micrel / Microchip Technology | IC CPLD 32MC 10NS 44TQFP | ATF15xx | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 44-TQFP |
CPLDs are programmable logic devices that contain configurable logic blocks and interconnects similar to FPGAs but with a smaller capacity and simpler architecture. CPLDs are often used in applications requiring glue logic, interface bridging, and simple state machine implementations. They offer advantages such as fast design turnaround, low power consumption, and predictable timing characteristics, making them suitable for a wide range of embedded system designs.