Loading products…
| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Manufacturer Part Number | Type | Lead Free Status | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| XC95288-20HQ208I | Xilinx | IC CPLD 288MC 20NS 208HQFP | XC9500 | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 208-BFQFP Exposed Pad | |
| XCR3512XL-12FGG324I | 4D Systems | IC CPLD 512MC 10.8NS 324BGA | CoolRunner XPLA3 | -40°C ~ 85°C (TA) | - | Surface Mount | Tray | XCR3512XL-12FGG324I | - | - | - | |
| XC95144XL-10TQ144C | Xilinx | IC CPLD 144MC 10NS 144TQFP | XC9500XL | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 144-LQFP | |
| ATF1502AS-10JC44 | Micrel / Microchip Technology | IC CPLD 32MC 10NS 44PLCC | ATF15xx | 0°C ~ 70°C (TA) | Tube | Surface Mount | - | - | - | - | 44-LCC (J-Lead) | |
| ISPLSI 2096A-80LQN128 | Lattice Semiconductor | IC CPLD 96MC 15NS 128QFP | ispLSI® 2000A | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 128-BQFP | |
| EPM7512BUC169-5N | Altera (Intel® Programmable Solutions Group) | IC CPLD 512MC 5.5NS 169UBGA | MAX® 7000B | 0°C ~ 70°C (TA) | Tray | - | - | - | - | - | - | |
| LC4256C-5FTN256BC | Lattice Semiconductor | IC CPLD 256MC 5NS 256FTBGA | ispMACH® 4000C | 0°C ~ 90°C (TJ) | Tray | Surface Mount | - | - | - | - | 256-LBGA | |
| M5-192/120-15YC/1 | Lattice Semiconductor | IC CPLD 192MC 15NS 160QFP | MACH® 5 | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 160-BQFP | |
| ISPGAL22V10AV-75LNN | Lattice Semiconductor | IC CPLD 10MC 7.5NS 32QFN | ispGAL™22V10 | 0°C ~ 75°C (TA) | Tray | Surface Mount | - | - | - | - | 32-VFQFN Exposed Pad | |
| LC4064V-5T44C | Lattice Semiconductor | IC CPLD 64MC 5NS 44TQFP | ispMACH® 4000V | 0°C ~ 90°C (TJ) | Tray | Surface Mount | - | - | - | - | 44-TQFP |
CPLDs are programmable logic devices that contain configurable logic blocks and interconnects similar to FPGAs but with a smaller capacity and simpler architecture. CPLDs are often used in applications requiring glue logic, interface bridging, and simple state machine implementations. They offer advantages such as fast design turnaround, low power consumption, and predictable timing characteristics, making them suitable for a wide range of embedded system designs.