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Embedded - CPLDs (Complex Programmable Logic Devices)

Embedded - CPLDs (Complex Programmable Logic Devices)

  1. Products
  2. Integrated Circuits (ICs)
  3. Embedded - CPLDs (Complex Programmable Logic Devices)
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Image Part Number Manufacturer Description Series Operating Temperature Packaging Mounting Type RoHS Status Manufacturer Part Number Type Lead Free Status Package / Case
EPM240T100C5 Altera (Intel® Programmable Solutions Group) IC CPLD 192MC 4.7NS 100TQFP MAX® II 0°C ~ 85°C (TJ) Tray Surface Mount - - - - 100-TQFP
ATF1504ASL-25JI44 Micrel / Microchip Technology IC CPLD 64MC 25NS 44PLCC ATF15xx -40°C ~ 85°C (TA) Tube Surface Mount - - - - 44-LCC (J-Lead)
LC4064C-5TN100I Lattice Semiconductor IC CPLD 64MC 5NS 100TQFP ispMACH® 4000C -40°C ~ 105°C (TJ) Tray Surface Mount - - - - 100-LQFP
5M2210ZF324C5N Altera (Intel® Programmable Solutions Group) IC CPLD 1700MC 7NS 324FBGA MAX® V 0°C ~ 85°C (TJ) Tray Surface Mount - - - - 324-LBGA
XC95108-7PC84I Xilinx IC CPLD 108MC 7.5NS 84PLCC XC9500 -40°C ~ 85°C (TA) Tube Surface Mount - - - - 84-LCC (J-Lead)
M4A3-32/32-12JNI Lattice Semiconductor IC CPLD 32MC 12NS 44PLCC ispMACH® 4A -40°C ~ 85°C (TA) Tray Surface Mount - - - - 44-LCC (J-Lead)
EPM9400RC240-20 Altera (Intel® Programmable Solutions Group) IC CPLD 400MC 20NS 240RQFP MAX® 9000 0°C ~ 70°C (TA) Tray Surface Mount - - - - 240-BFQFP Exposed Pad
XCR3256XL-7PQG208C Xilinx IC CPLD 256MC 7NS 208QFP CoolRunner XPLA3 0°C ~ 70°C (TA) Tray Surface Mount - - - - 208-BFQFP
EPM7064STC100-5F Altera (Intel® Programmable Solutions Group) IC CPLD 64MC 5NS 100TQFP MAX® 7000S 0°C ~ 70°C (TA) Tray Surface Mount - - - - 100-TQFP
EPM7128BFC100-7 Altera (Intel® Programmable Solutions Group) IC CPLD 128MC 7.5NS 100FBGA MAX® 7000B 0°C ~ 70°C (TA) Tray Surface Mount - - - - 100-LBGA

About Embedded - CPLDs (Complex Programmable Logic Devices)


CPLDs are programmable logic devices that contain configurable logic blocks and interconnects similar to FPGAs but with a smaller capacity and simpler architecture. CPLDs are often used in applications requiring glue logic, interface bridging, and simple state machine implementations. They offer advantages such as fast design turnaround, low power consumption, and predictable timing characteristics, making them suitable for a wide range of embedded system designs.