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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Manufacturer Part Number | Type | Lead Free Status | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| LC4256B-75TN176I | Lattice Semiconductor | IC CPLD 256MC 7.5NS 176TQFP | ispMACH® 4000B | -40°C ~ 105°C (TJ) | Tray | Surface Mount | - | - | - | - | 176-LQFP | |
| GAL16V8D-25QJN | Lattice Semiconductor | IC CPLD 8MC 25NS 20PLCC | GAL®16V8 | 0°C ~ 75°C (TA) | Bulk | Surface Mount | - | - | - | - | 20-LCC (J-Lead) | |
| XC95108-10PQG100C | Xilinx | IC CPLD 108MC 10NS 100QFP | XC9500 | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 100-BQFP | |
| XCR3064XL-7PC44C | Xilinx | IC CPLD 64MC 7NS 44PLCC | CoolRunner XPLA3 | 0°C ~ 70°C (TA) | Tube | Surface Mount | - | - | - | - | 44-LCC (J-Lead) | |
| EPM240GT100I5N | Altera (Intel® Programmable Solutions Group) | IC CPLD 192MC 4.7NS 100TQFP | MAX® II | -40°C ~ 100°C (TJ) | Tray | Surface Mount | - | - | - | - | 100-TQFP | |
| LC5768VG-10F484C | Lattice Semiconductor | IC CPLD 768MC 10NS 484FBGA | ispMACH™ 5000VG | 0°C ~ 90°C (TJ) | Tray | Surface Mount | - | - | - | - | 484-BBGA | |
| M4A3-512/192-12FAC | Lattice Semiconductor | IC CPLD 512MC 12NS 256FBGA | ispMACH® 4A | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 256-BGA | |
| M5-256/160-15YC/1 | Lattice Semiconductor | IC CPLD 256MC 15NS 208QFP | MACH® 5 | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 208-BFQFP | |
| M5LV-384/160-20YI | Lattice Semiconductor | IC CPLD 384MC 20NS 208QFP | MACH® 5 | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 208-BFQFP | |
| XC2C32A-4CP56C | Xilinx | IC CPLD 32MC 3.8NS 56BGA | CoolRunner II | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 56-LFBGA, CSPBGA |
CPLDs are programmable logic devices that contain configurable logic blocks and interconnects similar to FPGAs but with a smaller capacity and simpler architecture. CPLDs are often used in applications requiring glue logic, interface bridging, and simple state machine implementations. They offer advantages such as fast design turnaround, low power consumption, and predictable timing characteristics, making them suitable for a wide range of embedded system designs.