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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Manufacturer Part Number | Type | Lead Free Status | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| LC4256B-75FT256BI | Lattice Semiconductor | IC CPLD 256MC 7.5NS 256FTBG | ispMACH® 4000B | -40°C ~ 105°C (TJ) | Tray | Surface Mount | - | - | - | - | 256-LBGA | |
| XC2C256-7TQG144I | Xilinx | IC CPLD 256MC 6.7NS 144TQFP | CoolRunner II | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 144-LQFP | |
| LC4256C-5FT256BI | Lattice Semiconductor | IC CPLD 256MC 5NS 256FTBGA | ispMACH® 4000C | -40°C ~ 105°C (TJ) | Tray | Surface Mount | - | - | - | - | 256-LBGA | |
| ATF1508BE-7AU100 | Micrel / Microchip Technology | IC CPLD 128MC 7NS 100TQFP | ATF15xx | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 100-TQFP | |
| LC4064V-10TN100I | Lattice Semiconductor | IC CPLD 64MC 10NS 100TQFP | ispMACH® 4000V | -40°C ~ 105°C (TJ) | Tray | Surface Mount | - | - | - | - | 100-LQFP | |
| XC95216-10PQ160C | Xilinx | IC CPLD 216MC 10NS 160QFP | XC9500 | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 160-BQFP | |
| EPM570F100C5N | Altera (Intel® Programmable Solutions Group) | IC CPLD 440MC 5.4NS 100FBGA | MAX® II | 0°C ~ 85°C (TJ) | Tray | Surface Mount | - | - | - | - | 100-LBGA | |
| EPM7128AEFC100-5N | Intel® FPGAs | IC CPLD 128MC 5NS 100FBGA | MAX® 7000A | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 100-LBGA | |
| M4A3-512/160-14YI | Lattice Semiconductor | IC CPLD 512MC 14NS 208QFP | ispMACH® 4A | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 208-BFQFP | |
| LA4128V-75TN128E | Lattice Semiconductor | IC CPLD 128MC 7.5NS 128TQFP | LA-ispMACH | -40°C ~ 125°C (TA) | Tray | Surface Mount | - | - | - | - | 128-LQFP |
CPLDs are programmable logic devices that contain configurable logic blocks and interconnects similar to FPGAs but with a smaller capacity and simpler architecture. CPLDs are often used in applications requiring glue logic, interface bridging, and simple state machine implementations. They offer advantages such as fast design turnaround, low power consumption, and predictable timing characteristics, making them suitable for a wide range of embedded system designs.