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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Manufacturer Part Number | Type | Lead Free Status | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| EPM7064BTC48-5 | Altera (Intel® Programmable Solutions Group) | IC CPLD 64MC 5NS 48TQFP | MAX® 7000B | 0°C ~ 70°C (TA) | Tray | - | - | - | - | - | - | |
| ISPLSI 2032VE-135LJ44 | Lattice Semiconductor | IC CPLD 32MC 7.5NS 44PLCC | ispLSI® 2000VE | 0°C ~ 70°C (TA) | Tube | Surface Mount | - | - | - | - | 44-LCC (J-Lead) | |
| LC4064ZC-5T100C | Lattice Semiconductor | IC CPLD 64MC 5NS 100TQFP | ispMACH® 4000Z | 0°C ~ 90°C (TJ) | Tray | Surface Mount | - | - | - | - | 100-LQFP | |
| EPM1270F256C3 | Intel® FPGAs | IC CPLD 980MC 6.2NS 256FBGA | MAX® II | 0°C ~ 85°C (TJ) | Tray | Surface Mount | - | - | - | - | 256-BGA | |
| ISPGAL22V10AV-23LN | Lattice Semiconductor | IC CPLD 10MC 2.3NS 32QFN | ispGAL™22V10 | 0°C ~ 75°C (TA) | Tube | Surface Mount | - | - | - | - | 32-VFQFN Exposed Pad | |
| M4A3-512/192-7FANC | Lattice Semiconductor | IC CPLD 512MC 7.5NS 256FBGA | ispMACH® 4A | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 256-BGA | |
| LC5512MC-75FN484C | Lattice Semiconductor | IC CPLD 512MC 7.5NS 484FBGA | ispXPLD® 5000MC | 0°C ~ 90°C (TJ) | Tray | Surface Mount | - | - | - | - | 484-BBGA | |
| XC2C256-6PQ208C | Xilinx | IC CPLD 256MC 5.7NS 208QFP | CoolRunner II | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 208-BFQFP | |
| XC2C256-6TQ144C | Xilinx | IC CPLD 256MC 5.7NS 144QFP | CoolRunner II | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 144-LQFP | |
| XCR3128XL-7CSG144C | Xilinx | IC CPLD 128MC 7NS 144BGA | CoolRunner XPLA3 | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 144-TFBGA, CSPBGA |
CPLDs are programmable logic devices that contain configurable logic blocks and interconnects similar to FPGAs but with a smaller capacity and simpler architecture. CPLDs are often used in applications requiring glue logic, interface bridging, and simple state machine implementations. They offer advantages such as fast design turnaround, low power consumption, and predictable timing characteristics, making them suitable for a wide range of embedded system designs.