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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Manufacturer Part Number | Type | Lead Free Status | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| EPM7128AETC100-5 | Altera (Intel® Programmable Solutions Group) | IC CPLD 128MC 5NS 100TQFP | MAX® 7000A | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 100-TQFP | |
| CY39100V208B-200NTXC | Cypress Semiconductor | IC CPLD 1536MC 7.5NS 208BQFP | Delta 39K™ ISR™ | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 208-BFQFP | |
| XC95288XV-10FG256C | Xilinx | IC CPLD 288MC 10NS 256FBGA | XC9500XV | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 256-BGA | |
| LC4256B-75TN176C | Lattice Semiconductor | IC CPLD 256MC 7.5NS 176TQFP | ispMACH® 4000B | 0°C ~ 90°C (TJ) | Tray | Surface Mount | - | - | - | - | 176-LQFP | |
| EPM2210GF256C4N | Intel® FPGAs | IC CPLD 1700MC 7NS 256FBGA | MAX® II | 0°C ~ 85°C (TJ) | Tray | Surface Mount | - | - | - | - | 256-BGA | |
| EPM7032BTC44-7N | Altera (Intel® Programmable Solutions Group) | IC CPLD 32MC 7.5NS 44TQFP | MAX® 7000B | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 44-TQFP | |
| XCR3032XL-5CS48C | Xilinx | IC CPLD 32MC 4.5NS 48PLCC | CoolRunner XPLA3 | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 48-FBGA, CSPBGA | |
| M5-320/160-10YI | Lattice Semiconductor | IC CPLD 320MC 10NS 208QFP | MACH® 5 | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 208-BFQFP | |
| XC2C32A-6QFG32I | Xilinx | IC CPLD 32MC 5.5NS 32QFN | CoolRunner II | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 32-VFQFN Exposed Pad | |
| LC4384V-75T176C | Lattice Semiconductor | IC CPLD 384MC 7.5NS 176TQFP | ispMACH® 4000V | 0°C ~ 90°C (TJ) | Tray | Surface Mount | - | - | - | - | 176-LQFP |
CPLDs are programmable logic devices that contain configurable logic blocks and interconnects similar to FPGAs but with a smaller capacity and simpler architecture. CPLDs are often used in applications requiring glue logic, interface bridging, and simple state machine implementations. They offer advantages such as fast design turnaround, low power consumption, and predictable timing characteristics, making them suitable for a wide range of embedded system designs.