Loading products…
| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Manufacturer Part Number | Type | Lead Free Status | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| EPM7128AETC100-7 | Intel® FPGAs | IC CPLD 128MC 7.5NS 100TQFP | MAX® 7000A | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 100-TQFP | |
| ATF750C-15PI | Micrel / Microchip Technology | IC CPLD 10MC 15NS 24DIP | ATF750C(L) | -40°C ~ 85°C (TA) | Tube | Through Hole | - | - | - | - | 24-DIP (0.300", 7.62mm) | |
| ATF1504AS-7QC100 | Micrel / Microchip Technology | IC CPLD 64MC 7.5NS 100QFP | ATF15xx | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 100-BQFP | |
| M5LV-512/120-12YC | Lattice Semiconductor | IC CPLD 512MC 12NS 160QFP | MACH® 5 | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 160-BQFP | |
| EPM7128AETC100-10N | Altera (Intel® Programmable Solutions Group) | IC CPLD 128MC 10NS 100TQFP | MAX® 7000A | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 100-TQFP | |
| XC2C32A-4VQ44C | Xilinx | IC CPLD 32MC 3.8NS 44VQFP | CoolRunner II | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 44-TQFP | |
| XC2C256-7CP132I | Xilinx | IC CPLD 256MC 6.7NS 132BGA | CoolRunner II | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 132-TFBGA, CSPBGA | |
| LC4256V-75T144C | Lattice Semiconductor | IC CPLD 256MC 7.5NS 144TQFP | ispMACH® 4000V | 0°C ~ 90°C (TJ) | Tray | Surface Mount | - | - | - | - | 144-LQFP | |
| M5-192/120-15YI/1 | Lattice Semiconductor | IC CPLD 192MC 15NS 160QFP | MACH® 5 | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 160-BQFP | |
| LC5256MV-4F256C | Lattice Semiconductor | IC CPLD 256MC 4NS 256FBGA | ispXPLD® 5000MV | 0°C ~ 90°C (TJ) | Tray | Surface Mount | - | - | - | - | 256-BGA |
CPLDs are programmable logic devices that contain configurable logic blocks and interconnects similar to FPGAs but with a smaller capacity and simpler architecture. CPLDs are often used in applications requiring glue logic, interface bridging, and simple state machine implementations. They offer advantages such as fast design turnaround, low power consumption, and predictable timing characteristics, making them suitable for a wide range of embedded system designs.