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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Manufacturer Part Number | Type | Lead Free Status | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| ATF1508ASL-25QI160 | Micrel / Microchip Technology | IC CPLD 128MC 25NS 160QFP | ATF15xx | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 160-BQFP | |
| GAL16V8D-10LJNI | Lattice Semiconductor | IC CPLD 8MC 10NS 20PLCC | GAL®16V8 | -40°C ~ 85°C (TA) | Bulk | Surface Mount | - | - | - | - | 20-LCC (J-Lead) | |
| M5LV-256/74-7VC | Lattice Semiconductor | IC CPLD 256MC 7.5NS 100TQFP | MACH® 5 | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 100-LQFP | |
| CY37032VP44-100AXIT | Cypress Semiconductor | IC CPLD 32MC 12NS 44LQFP | Ultra37000™ | -40°C ~ 85°C (TA) | Tape & Reel (TR) | Surface Mount | - | - | - | - | 44-LQFP | |
| LC4064B-5TN48C | Lattice Semiconductor | IC CPLD 64MC 5NS 48TQFP | ispMACH® 4000B | 0°C ~ 90°C (TJ) | Tray | Surface Mount | - | - | - | - | 48-LQFP | |
| EPM570ZM256I8N | Intel® FPGAs | IC CPLD 440MC 9NS 256MBGA | MAX® II | -40°C ~ 100°C (TJ) | Tray | Surface Mount | - | - | - | - | 256-TFBGA | |
| ATF1508ASV-15QI160 | Micrel / Microchip Technology | IC CPLD 128MC 15NS 160QFP | ATF15xx | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 160-BQFP | |
| M5-192/68-12VI/1 | Lattice Semiconductor | IC CPLD 192MC 12NS 100TQFP | MACH® 5 | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 100-LQFP | |
| EPM7032LI44-15 | Altera (Intel® Programmable Solutions Group) | IC CPLD 32MC 15NS 44PLCC | MAX® 7000 | -40°C ~ 85°C (TA) | Tube | Surface Mount | - | - | - | - | 44-LCC (J-Lead) | |
| XC95144XL-10TQ144I | Xilinx | IC CPLD 144MC 10NS 144TQFP | XC9500XL | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 144-LQFP |
CPLDs are programmable logic devices that contain configurable logic blocks and interconnects similar to FPGAs but with a smaller capacity and simpler architecture. CPLDs are often used in applications requiring glue logic, interface bridging, and simple state machine implementations. They offer advantages such as fast design turnaround, low power consumption, and predictable timing characteristics, making them suitable for a wide range of embedded system designs.