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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Manufacturer Part Number | Type | Lead Free Status | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| XCR3064XL-7CPG56I | Xilinx | IC CPLD 64MC 7NS 56CSP | CoolRunner XPLA3 | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 56-LFBGA, CSPBGA | |
| LC4128V-5T128I | Lattice Semiconductor | IC CPLD 128MC 5NS 128TQFP | ispMACH® 4000V | -40°C ~ 105°C (TJ) | Tray | Surface Mount | - | - | - | - | 128-LQFP | |
| LC4256V-75FTN256AC | Lattice Semiconductor | IC CPLD 256MC 7.5NS 256FTBGA | ispMACH® 4000V | 0°C ~ 90°C (TJ) | Tray | Surface Mount | - | - | - | - | 256-LBGA | |
| XC2C512-10FTG256I | Xilinx | IC CPLD 512MC 9.2NS 256FTBGA | CoolRunner II | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 256-LBGA | |
| EPM2210F256C4 | Intel® FPGAs | IC CPLD 1700MC 7NS 256FBGA | MAX® II | 0°C ~ 85°C (TJ) | Tray | Surface Mount | - | - | - | - | 256-BGA | |
| XCR3032XL-5VQ44C | Xilinx | IC CPLD 32MC 4.5NS 44VQFP | CoolRunner XPLA3 | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 44-TQFP | |
| EPM3032ALC44-10 | Altera (Intel® Programmable Solutions Group) | IC CPLD 32MC 10NS 44PLCC | MAX® 3000A | 0°C ~ 70°C (TA) | Tube | Surface Mount | - | - | - | - | 44-LCC (J-Lead) | |
| CY39050V208-125NTXC | Cypress Semiconductor | IC CPLD 768MC 10NS 208BQFP | Delta 39K™ ISR™ | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 208-BFQFP | |
| LC4128V-75TN144E | Lattice Semiconductor | IC CPLD 128MC 7.5NS 144TQFP | ispMACH® 4000V | -40°C ~ 130°C (TJ) | Tray | Surface Mount | - | - | - | - | 144-LQFP | |
| LC4032C-10TN48I | Lattice Semiconductor | IC CPLD 32MC 10NS 48TQFP | ispMACH® 4000C | -40°C ~ 105°C (TJ) | Tray | Surface Mount | - | - | - | - | 48-LQFP |
CPLDs are programmable logic devices that contain configurable logic blocks and interconnects similar to FPGAs but with a smaller capacity and simpler architecture. CPLDs are often used in applications requiring glue logic, interface bridging, and simple state machine implementations. They offer advantages such as fast design turnaround, low power consumption, and predictable timing characteristics, making them suitable for a wide range of embedded system designs.