Loading products…
| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Manufacturer Part Number | Type | Lead Free Status | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| M4A3-512/256-14FAI | Lattice Semiconductor | IC CPLD 512MC 14NS 388FBGA | ispMACH® 4A | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 388-BBGA | |
| LC4032B-75T44I | Lattice Semiconductor | IC CPLD 32MC 7.5NS 44TQFP | ispMACH® 4000B | -40°C ~ 105°C (TJ) | Tray | Surface Mount | - | - | - | - | 44-TQFP | |
| 5M570ZT100A5N | Altera (Intel® Programmable Solutions Group) | IC CPLD 440MC 9NS 100TQFP | MAX® V | -40°C ~ 125°C (TJ) | Tray | Surface Mount | - | - | - | - | 100-TQFP | |
| ISPLSI 2096A-100LQN128 | Lattice Semiconductor | IC CPLD 96MC 10NS 128QFP | ispLSI® 2000A | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 128-BQFP | |
| LC4064V-25T100C | Lattice Semiconductor | IC CPLD 64MC 2.5NS 100TQFP | ispMACH® 4000V | 0°C ~ 90°C (TJ) | Tray | Surface Mount | - | - | - | - | 100-LQFP | |
| GAL22V10D-10QJ | Lattice Semiconductor | IC CPLD 10MC 10NS 28PLCC | GAL®22V10 | 0°C ~ 75°C (TA) | Bulk | Surface Mount | - | - | - | - | 28-LCC (J-Lead) | |
| M5-256/160-10YI/1 | Lattice Semiconductor | IC CPLD 256MC 10NS 208QFP | MACH® 5 | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 208-BFQFP | |
| EPM7032QC44-6 | Altera (Intel® Programmable Solutions Group) | IC CPLD 32MC 6NS 44PLCC | MAX® 7000 | 0°C ~ 70°C (TA) | Tray | - | - | - | - | - | - | |
| XC95144-10PQ100I | Xilinx | IC CPLD 144MC 10NS 100QFP | XC9500 | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 100-BQFP | |
| XC9572XL-10TQ100I | Xilinx | IC CPLD 72MC 10NS 100TQFP | XC9500XL | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 100-LQFP |
CPLDs are programmable logic devices that contain configurable logic blocks and interconnects similar to FPGAs but with a smaller capacity and simpler architecture. CPLDs are often used in applications requiring glue logic, interface bridging, and simple state machine implementations. They offer advantages such as fast design turnaround, low power consumption, and predictable timing characteristics, making them suitable for a wide range of embedded system designs.