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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Manufacturer Part Number | Type | Lead Free Status | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| M4A5-256/128-12YI | Lattice Semiconductor | IC CPLD 256MC 12NS 208QFP | ispMACH® 4A | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 208-BFQFP | |
| ATF1504ASVL-20JU44 | Micrel / Microchip Technology | IC CPLD 64MC 20NS 44PLCC | ATF15xx | -40°C ~ 85°C (TA) | Tube | Surface Mount | - | - | - | - | 44-LCC (J-Lead) | |
| LC4256ZC-45TN176C | Lattice Semiconductor | IC CPLD 256MC 4.5NS 176TQFP | ispMACH® 4000Z | 0°C ~ 90°C (TJ) | Tray | Surface Mount | - | - | - | - | 176-LQFP | |
| XC95144XL-7TQ144C | Xilinx | IC CPLD 144MC 7.5NS 144TQFP | XC9500XL | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 144-LQFP | |
| XC95288-20BG352C | Xilinx | IC CPLD 288MC 20NS 352BGA | XC9500 | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 352-LBGA Exposed Pad, Metal | |
| M4A3-256/128-55FAC | Lattice Semiconductor | IC CPLD 256MC 5.5NS 256FBGA | ispMACH® 4A | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 256-BGA | |
| XC2C128-7VQG100I | Xilinx | IC CPLD 128MC 7NS 100VQFP | CoolRunner II | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 100-TQFP | |
| XC2C32A-6QFG32C | Xilinx | IC CPLD 32MC 5.5NS 32QFN | CoolRunner II | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 32-VFQFN Exposed Pad | |
| LC4128V-27T144C | Lattice Semiconductor | IC CPLD 128MC 2.7NS 144TQFP | ispMACH® 4000V | 0°C ~ 90°C (TJ) | Tray | Surface Mount | - | - | - | - | 144-LQFP | |
| M5-128/68-15YI/1 | Lattice Semiconductor | IC CPLD 128MC 15NS 100QFP | MACH® 5 | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 100-BQFP |
CPLDs are programmable logic devices that contain configurable logic blocks and interconnects similar to FPGAs but with a smaller capacity and simpler architecture. CPLDs are often used in applications requiring glue logic, interface bridging, and simple state machine implementations. They offer advantages such as fast design turnaround, low power consumption, and predictable timing characteristics, making them suitable for a wide range of embedded system designs.