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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Manufacturer Part Number | Type | Lead Free Status | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| EPM3512AQC208-7 | Altera (Intel® Programmable Solutions Group) | IC CPLD 512MC 7.5NS 208QFP | MAX® 3000A | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 208-BFQFP | |
| XC9536XL-5PCG44C | Xilinx | IC CPLD 36MC 5NS 44PLCC | XC9500XL | 0°C ~ 70°C (TA) | Tube | Surface Mount | - | - | - | - | 44-LCC (J-Lead) | |
| LC4256V-3T176C | Lattice Semiconductor | IC CPLD 256MC 3NS 176TQFP | ispMACH® 4000V | 0°C ~ 90°C (TJ) | Tray | Surface Mount | - | - | - | - | 176-LQFP | |
| XC9572XL-5VQG44C | Xilinx | IC CPLD 72MC 5NS 44VQFP | XC9500XL | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 44-TQFP | |
| LC4384V-10FTN256I | Lattice Semiconductor | IC CPLD 384MC 10NS 256FTBGA | ispMACH® 4000V | -40°C ~ 105°C (TJ) | Tray | Surface Mount | - | - | - | - | 256-LBGA | |
| XCR3064XL-7VQG100I | Xilinx | IC CPLD 64MC 7NS 100VQFP | CoolRunner XPLA3 | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 100-TQFP | |
| M5LV-256/74-10VI | Lattice Semiconductor | IC CPLD 256MC 10NS 100TQFP | MACH® 5 | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 100-LQFP | |
| LC4128V-10TN128I | Lattice Semiconductor | IC CPLD 128MC 10NS 128TQFP | ispMACH® 4000V | -40°C ~ 105°C (TJ) | Tray | Surface Mount | - | - | - | - | 128-LQFP | |
| XC2C128-6CPG132C | Xilinx | IC CPLD 128MC 5.7NS 132CSBGA | CoolRunner II | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 132-TFBGA, CSPBGA | |
| ISPGAL22LV10-4LK | Lattice Semiconductor | IC CPLD 10MC 4NS 28SSOP | ispGAL™22LV10 | 0°C ~ 75°C (TA) | Tube | Surface Mount | - | - | - | - | 28-SSOP (0.209", 5.30mm Width) |
CPLDs are programmable logic devices that contain configurable logic blocks and interconnects similar to FPGAs but with a smaller capacity and simpler architecture. CPLDs are often used in applications requiring glue logic, interface bridging, and simple state machine implementations. They offer advantages such as fast design turnaround, low power consumption, and predictable timing characteristics, making them suitable for a wide range of embedded system designs.