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Embedded - CPLDs (Complex Programmable Logic Devices)

Embedded - CPLDs (Complex Programmable Logic Devices)

  1. Products
  2. Integrated Circuits (ICs)
  3. Embedded - CPLDs (Complex Programmable Logic Devices)
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Image Part Number Manufacturer Description Series Operating Temperature Packaging Mounting Type RoHS Status Manufacturer Part Number Type Lead Free Status Package / Case
EPM7160EQC160-12 Altera (Intel® Programmable Solutions Group) IC CPLD 160MC 12NS 160QFP MAX® 7000 0°C ~ 70°C (TA) Tray Surface Mount - - - - 160-BQFP
EPM7064LC84-7 Altera (Intel® Programmable Solutions Group) IC CPLD 64MC 7.5NS 84PLCC MAX® 7000 0°C ~ 70°C (TA) Tube Surface Mount - - - - 84-LCC (J-Lead)
EPM7032BTC48-7 Altera (Intel® Programmable Solutions Group) IC CPLD 32MC 7.5NS 48TQFP MAX® 7000B 0°C ~ 70°C (TA) Bulk Surface Mount - - - - 48-TQFP
LC4256C-3TN100C Lattice Semiconductor IC CPLD 256MC 3NS 100TQFP ispMACH® 4000C 0°C ~ 90°C (TJ) Tray Surface Mount - - - - 100-LQFP
ATF1508ASL-25QC160 Micrel / Microchip Technology IC CPLD 128MC 25NS 160QFP ATF15xx 0°C ~ 70°C (TA) Tray Surface Mount - - - - 160-BQFP
EPM7064STC44-10 Altera (Intel® Programmable Solutions Group) IC CPLD 64MC 10NS 44TQFP MAX® 7000S 0°C ~ 70°C (TA) Tray Surface Mount - - - - 44-TQFP
5M240ZM100I5N Altera (Intel® Programmable Solutions Group) IC CPLD 192MC 7.5NS 100MBGA MAX® V -40°C ~ 100°C (TJ) Tray Surface Mount - - - - 100-TFBGA
GAL20RA10B-20LJI Lattice Semiconductor IC CPLD 10MC 20NS 28PLCC GAL®20RA10 -40°C ~ 85°C (TA) Tube Surface Mount - - - - 28-LCC (J-Lead)
GAL16V8D-25LPNI Lattice Semiconductor IC CPLD 8MC 25NS 20DIP GAL®16V8 -40°C ~ 85°C (TA) Bulk Through Hole - - - - 20-DIP (0.300", 7.62mm)
XCR3032XL-10VQG44C Xilinx IC CPLD 32MC 9.1NS 44VQFP CoolRunner XPLA3 0°C ~ 70°C (TA) Tray Surface Mount - - - - 44-TQFP

About Embedded - CPLDs (Complex Programmable Logic Devices)


CPLDs are programmable logic devices that contain configurable logic blocks and interconnects similar to FPGAs but with a smaller capacity and simpler architecture. CPLDs are often used in applications requiring glue logic, interface bridging, and simple state machine implementations. They offer advantages such as fast design turnaround, low power consumption, and predictable timing characteristics, making them suitable for a wide range of embedded system designs.