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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Manufacturer Part Number | Type | Lead Free Status | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| EPM570ZM144I8N | Intel® FPGAs | IC CPLD 440MC 9NS 144MBGA | MAX® II | -40°C ~ 100°C (TJ) | Tray | Surface Mount | - | - | - | - | 144-TFBGA | |
| LC4256B-75FTN256AC | Lattice Semiconductor | IC CPLD 256MC 7.5NS 256FTBGA | ispMACH® 4000B | 0°C ~ 90°C (TJ) | Tray | Surface Mount | - | - | - | - | 256-LBGA | |
| ATF1502AS-15AC44 | Micrel / Microchip Technology | IC CPLD 32MC 15NS 44TQFP | ATF15xx | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 44-TQFP | |
| M4A3-512/256-12FAC | Lattice Semiconductor | IC CPLD 512MC 12NS 388FBGA | ispMACH® 4A | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 388-BBGA | |
| EPM1270GM256C5N | Intel® FPGAs | IC CPLD 980MC 6.2NS 256MBGA | MAX® II | 0°C ~ 85°C (TJ) | Tray | Surface Mount | - | - | - | - | 256-TFBGA | |
| ATF1504ASL-25AI44 | Micrel / Microchip Technology | IC CPLD 64MC 25NS 44TQFP | ATF15xx | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 44-TQFP | |
| CY37064VP100-100AXC | Cypress Semiconductor | IC CPLD 64MC 12NS 100LQFP | Ultra37000™ | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 100-LQFP | |
| EPM7160EQI160-15 | Altera (Intel® Programmable Solutions Group) | IC CPLD 160MC 15NS 160QFP | MAX® 7000 | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 160-BQFP | |
| XCR3384XL-10PQG208C | Xilinx | IC CPLD 384MC 9NS 208QFP | CoolRunner XPLA3 | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 208-BFQFP | |
| CY39030V208-125NTXC | Cypress Semiconductor | IC CPLD 512MC 10NS 208BQFP | Delta 39K™ ISR™ | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 208-BFQFP |
CPLDs are programmable logic devices that contain configurable logic blocks and interconnects similar to FPGAs but with a smaller capacity and simpler architecture. CPLDs are often used in applications requiring glue logic, interface bridging, and simple state machine implementations. They offer advantages such as fast design turnaround, low power consumption, and predictable timing characteristics, making them suitable for a wide range of embedded system designs.