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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Manufacturer Part Number | Type | Lead Free Status | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| ISPLSI 2096A-125LTN128 | Lattice Semiconductor | IC CPLD 96MC 7.5NS 128TQFP | ispLSI® 2000A | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 128-LQFP | |
| M4A5-96/48-12VNI | Lattice Semiconductor | IC CPLD 96MC 12NS 100TQFP | ispMACH® 4A | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 100-LQFP | |
| ATV2500BQL-25KI | Micrel / Microchip Technology | IC CPLD 24MC 25NS 44JLCC | ATV2500B(L) and BQ(L) | -40°C ~ 85°C (TA) | Tube | Surface Mount | - | - | - | - | 44-CLCC, Window (J-Lead) | |
| M4A3-256/128-7YI | Lattice Semiconductor | IC CPLD 256MC 7.5NS 208QFP | ispMACH® 4A | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 208-BFQFP | |
| EPM570GT144C4N | Intel® FPGAs | IC CPLD 440MC 5.4NS 144TQFP | MAX® II | 0°C ~ 85°C (TJ) | Tray | Surface Mount | - | - | - | - | 144-LQFP | |
| GAL16V8D-25LP | Lattice Semiconductor | IC CPLD 8MC 25NS 20DIP | GAL®16V8 | 0°C ~ 75°C (TA) | Bulk | Through Hole | - | - | - | - | 20-DIP (0.300", 7.62mm) | |
| XC9572XV-5TQ100C | Xilinx | IC CPLD 72MC 5NS 100TQFP | XC9500XV | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 100-LQFP | |
| M4A3-512/192-12FAI | Lattice Semiconductor | IC CPLD 512MC 12NS 256FBGA | ispMACH® 4A | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 256-BGA | |
| ISPLSI 2096E-135LQ128 | Lattice Semiconductor | IC CPLD 96MC 7.5NS 128QFP | ispLSI® 2000E | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 128-BQFP | |
| LC5256MB-75F256C | Lattice Semiconductor | IC CPLD 256MC 7.5NS 256FBGA | ispXPLD® 5000MB | 0°C ~ 90°C (TJ) | Tray | Surface Mount | - | - | - | - | 256-BGA |
CPLDs are programmable logic devices that contain configurable logic blocks and interconnects similar to FPGAs but with a smaller capacity and simpler architecture. CPLDs are often used in applications requiring glue logic, interface bridging, and simple state machine implementations. They offer advantages such as fast design turnaround, low power consumption, and predictable timing characteristics, making them suitable for a wide range of embedded system designs.