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Embedded - CPLDs (Complex Programmable Logic Devices)

Embedded - CPLDs (Complex Programmable Logic Devices)

  1. Products
  2. Integrated Circuits (ICs)
  3. Embedded - CPLDs (Complex Programmable Logic Devices)
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Image Part Number Manufacturer Description Series Operating Temperature Packaging Mounting Type RoHS Status Manufacturer Part Number Type Lead Free Status Package / Case
ATF1508ASV-15JI84 Micrel / Microchip Technology IC CPLD 128MC 15NS 84PLCC ATF15xx -40°C ~ 85°C (TA) Tube Surface Mount - - - - 84-LCC (J-Lead)
ISPLSI 2128VE-250LTN100 Lattice Semiconductor IC CPLD 128MC 4NS 100TQFP ispLSI® 2000VE 0°C ~ 70°C (TA) Tray Surface Mount - - - - 100-LQFP
EPM3128ATI144-10 Altera (Intel® Programmable Solutions Group) IC CPLD 128MC 10NS 144TQFP MAX® 3000A -40°C ~ 85°C (TA) Tray Surface Mount - - - - 144-LQFP
M4A3-64/64-55VNC Lattice Semiconductor IC CPLD 64MC 5.5NS 100TQFP ispMACH® 4A 0°C ~ 70°C (TA) Tray Surface Mount - - - - 100-LQFP
LC4384C-75TN176C Lattice Semiconductor IC CPLD 384MC 7.5NS 176TQFP ispMACH® 4000C 0°C ~ 90°C (TJ) Tray Surface Mount - - - - 176-LQFP
EPM3064ALC44-7N Altera (Intel® Programmable Solutions Group) IC CPLD 64MC 7.5NS 44PLCC MAX® 3000A 0°C ~ 70°C (TA) Tray Surface Mount - - - - 44-LCC (J-Lead)
LC4256B-75FT256AC Lattice Semiconductor IC CPLD 256MC 7.5NS 256FTBG ispMACH® 4000B 0°C ~ 90°C (TJ) Tray Surface Mount - - - - 256-LBGA
LC4384V-75TN176I Lattice Semiconductor IC CPLD 384MC 7.5NS 176TQFP ispMACH® 4000V -40°C ~ 105°C (TJ) Tray Surface Mount - - - - 176-LQFP
LC51024MV-75F672C Lattice Semiconductor IC CPLD 1024MC 7.5NS 672FBGA ispXPLD® 5000MV 0°C ~ 90°C (TJ) Tray Surface Mount - - - - 672-BBGA
ISPLSI 5512VE-155LF256 Lattice Semiconductor IC CPLD 512MC 6.5NS 256FBGA ispLSI® 5000VE 0°C ~ 70°C (TA) Tray Surface Mount - - - - 256-BGA

About Embedded - CPLDs (Complex Programmable Logic Devices)


CPLDs are programmable logic devices that contain configurable logic blocks and interconnects similar to FPGAs but with a smaller capacity and simpler architecture. CPLDs are often used in applications requiring glue logic, interface bridging, and simple state machine implementations. They offer advantages such as fast design turnaround, low power consumption, and predictable timing characteristics, making them suitable for a wide range of embedded system designs.