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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Manufacturer Part Number | Type | Lead Free Status | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| ATF1504AS-15AC44 | Micrel / Microchip Technology | IC CPLD 64MC 15NS 44TQFP | ATF15xx | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 44-TQFP | |
| M4A5-192/96-7VC | Lattice Semiconductor | IC CPLD 192MC 7.5NS 144TQFP | ispMACH® 4A | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 144-LQFP | |
| XC2C128-7CPG132I | Xilinx | IC CPLD 128MC 7NS 132CSBGA | CoolRunner II | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 132-TFBGA, CSPBGA | |
| XC9536XV-5CS48C | Xilinx | IC CPLD 36MC 5NS 48CSP | XC9500XV | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 48-FBGA, CSPBGA | |
| EPM1270T144C4N | Altera (Intel® Programmable Solutions Group) | IC CPLD 980MC 6.2NS 144TQFP | MAX® II | 0°C ~ 85°C (TJ) | Tray | Surface Mount | - | - | - | - | 144-LQFP | |
| XC2C384-10PQG208I | Xilinx | IC CPLD 384MC 9.2NS 208QFP | CoolRunner II | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 208-BFQFP | |
| EPM7512AEBC256-10N | Altera (Intel® Programmable Solutions Group) | IC CPLD 512MC 10NS 256BGA | MAX® 7000A | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 256-LBGA | |
| M4A5-96/48-10VC | Lattice Semiconductor | IC CPLD 96MC 10NS 100TQFP | ispMACH® 4A | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 100-LQFP | |
| ATF1508AS-10AU100 | Micrel / Microchip Technology | IC CPLD 128MC 10NS 100TQFP | ATF15xx | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 100-TQFP | |
| EPM7512AEFC256-12 | Intel® FPGAs | IC CPLD 512MC 12NS 256FBGA | MAX® 7000A | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 256-BGA |
CPLDs are programmable logic devices that contain configurable logic blocks and interconnects similar to FPGAs but with a smaller capacity and simpler architecture. CPLDs are often used in applications requiring glue logic, interface bridging, and simple state machine implementations. They offer advantages such as fast design turnaround, low power consumption, and predictable timing characteristics, making them suitable for a wide range of embedded system designs.