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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Manufacturer Part Number | Type | Lead Free Status | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| XC95108-20PC84C | Xilinx | IC CPLD 108MC 20NS 84PLCC | XC9500 | 0°C ~ 70°C (TA) | Tube | Surface Mount | - | - | - | - | 84-LCC (J-Lead) | |
| XCR3256XL-10CSG280C | Xilinx | IC CPLD 256MC 9NS 280CSP | CoolRunner XPLA3 | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 280-TFBGA, CSPBGA | |
| M4A5-192/96-10VI | Lattice Semiconductor | IC CPLD 192MC 10NS 144TQFP | ispMACH® 4A | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 144-LQFP | |
| ATV2500BQL-25JC | Micrel / Microchip Technology | IC CPLD 48MACR QP LP OTP 44PLCC | ATV2500B(L) and BQ(L) | 0°C ~ 70°C (TA) | Tube | Surface Mount | - | - | - | - | 44-LCC (J-Lead) | |
| XA2C64A-8VQG44Q | Xilinx | IC CPLD 64MC 6.7NS 44VQFP | CoolRunner II | -40°C ~ 105°C (TA) | Tray | Surface Mount | - | - | - | - | 44-TQFP | |
| CY39030V208-125NTXI | Cypress Semiconductor | IC CPLD 512MC 10NS 208BQFP | Delta 39K™ ISR™ | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 208-BFQFP | |
| ATV2500BQ-25PC | Micrel / Microchip Technology | IC CPLD 48 MACRO Q-PWR OTP 40DIP | ATV2500B(L) and BQ(L) | 0°C ~ 70°C (TA) | Tube | Through Hole | - | - | - | - | 40-DIP (0.600", 15.24mm) | |
| EPM7032SLC44-10F | Altera (Intel® Programmable Solutions Group) | IC CPLD 32MC 10NS 44PLCC | MAX® 7000S | 0°C ~ 70°C (TA) | Tube | Surface Mount | - | - | - | - | 44-LCC (J-Lead) | |
| EPM570GT100C3 | Intel® FPGAs | IC CPLD 440MC 5.4NS 100TQFP | MAX® II | 0°C ~ 85°C (TJ) | Tray | Surface Mount | - | - | - | - | 100-TQFP | |
| XC9572XV-7PC44C | Xilinx | IC CPLD 72MC 7.5NS 44PLCC | XC9500XV | 0°C ~ 70°C (TA) | Tube | Surface Mount | - | - | - | - | 44-LCC (J-Lead) |
CPLDs are programmable logic devices that contain configurable logic blocks and interconnects similar to FPGAs but with a smaller capacity and simpler architecture. CPLDs are often used in applications requiring glue logic, interface bridging, and simple state machine implementations. They offer advantages such as fast design turnaround, low power consumption, and predictable timing characteristics, making them suitable for a wide range of embedded system designs.